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Polishing of single point diamond tool based on thermo-chemical reaction with copper

Author
FURUSHIRO, Naomichi1 ; HIGUCHI, Masahiro1 ; YAMAGUCHI, Tomomi1 ; SHIMADA, Shoichi2 ; OBATA, Kazushi3
[1] Kansai University, 3-3-35 Yamate-cho, Suita, Osaka 564-8680, Japan
[2] Osaka Electro-Communication University, 18-8 Hatsu-cho, Neyagawa, Osaka 572-8530, Japan
[3] A.L.M.T. Corp., 1-4-16, Kyomachibori, Nishi-ku, Osaka 550-0003, Japan
Source

Precision engineering. 2009, Vol 33, Num 4, pp 486-491, 6 p ; ref : 12 ref

CODEN
PREGDL
ISSN
0141-6359
Scientific domain
Mechanical engineering; Metallurgy, welding
Publisher
Elsevier, New York, NY
Publication country
United States
Document type
Article
Language
English
Author keyword
Crack healing Diamond cutting tool Fracture strength Thermo-chemical polishing Tool life Wear rate
Keyword (fr)
Cuivre Diamant Décapage Erosion Microfissure Mécanique précision Nanotechnologie Outil coupe Outil diamant Oxyde de cuivre Polissage chimique Rupture Réaction chimique Traitement surface
Keyword (en)
Copper Diamond Pickling Erosion Microcrack Precision engineering Nanotechnology Cutting tool Diamond tool Copper oxide Chemical polishing Rupture Chemical reaction Surface treatment
Keyword (es)
Cobre Diamante Decapado Erosión Microfisura Mecánica precisión Nanotecnología Herramienta corte Diamante Cobre óxido Pulido químico Ruptura Reacción química Tratamiento superficie
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D12 Mechanical engineering. Machine design / 001D12I Precision engineering, watch making

Discipline
Mechanical engineering. Mechanical construction. Handling
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
21810234

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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