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Effect of Grain Size and Testing Temperature on Low-Cycle Fatigue Behavior and Plastic Deformation Mode of Ti-2AI-2.5Zr

Author
WANG, H1 ; XU, Y. L1 ; SUN, Q. Y1 ; XIAO, L1 ; SUN, J1 ; GE, P2
[1] State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an, 710049, China
[2] Northwest Institute for Nonferrous Meta Research, Xi'an 710016, China
Source

Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2009, Vol 40, Num 11, pp 2631-2643, 13 p ; ref : 33 ref

CODEN
MMTAEB
ISSN
1073-5623
Scientific domain
Crystallography; Metallurgy, welding; Condensed state physics
Publisher
Springer, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Déformation plastique Fatigue oligocyclique Grosseur grain Microstructure Mode déformation Température Propriété mécanique
Keyword (en)
Plastic deformation Low cycle fatigue Grain size Microstructure Deformation mode Temperature Mechanical properties
Keyword (es)
Deformación plástica Fatiga oligocíclica Grosor grano Microestructura Modo deformación Temperatura Propiedad mecánica
Keyword (de)
Plastische Verformung Ermuedung bei niedrigen Lastspielzahlen Korngroesse Mikrogefuege Temperatur
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11G Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology / 001D11G03 Fatigue

Discipline
Metals. Metallurgy
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
22037117

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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