Polymer-metal nano-composite films for thermal management
- Author
- CARLBERG, Björn1 ; TENG WANG1 ; FOHAN LIU2 3 ; SHANGGUAN, Dongkai3
[1] Department of Microtechnology and Nanoscience, Sino-Swedish Microsystem Integration Technology Center, Chalmers University of Technology, Göteborg, Sweden
[2] Department of Microtechnology and Nanoscience, Sino-Swedish Microsystem Integration Technology Center, Chalmers University of Technology, Göteborg, Sweden
[3] Key State Laboratory for New Displays and System Applications, Sino-Swedish Microsystem Integration Technology Center, Shanghai University, Shanghai, China - Source
Microelectronics international. 2009, Vol 26, Num 2, pp 28-36, 9 p ; ref : 3/4 p
- ISSN
- 1356-5362
- Scientific domain
- Electronics
- Publisher
- MCB University Press, Bradford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Author keyword
- Composite materials Electronic engineering Films (states of matter) Thermal conductivity Thermal resistance
- Keyword (fr)
- Analyse coût efficacité Comportement thermique Conductivité thermique Couche mince métallique Critère performance Etat actuel Etude comparative Film polymère Gestion température packaging électronique Génie électronique Haute performance Implémentation Matériau composite Matériau poreux Microélectronique Nanocomposite Nanomatériau Packaging électronique Polymère Résistance thermique
- Keyword (en)
- Cost efficiency analysis Thermal behavior Thermal conductivity Metallic thin films Performance requirement State of the art Comparative study Polymer films Thermal management (packaging) Electronic engineering High performance Implementation Composite material Porous material Microelectronics Nanocomposite Nanostructured materials Electronic packaging Polymer Thermal resistance
- Keyword (es)
- Análisis costo eficacia Comportamiento térmico Conductividad térmica Criterio resultado Estado actual Estudio comparativo Alto rendimiento Implementación Material compuesto Material poroso Microelectrónica Nanocompuesto Packaging electrónico Polímero Resistencia térmica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22047042
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1108/13565360910960213 
https://dx.doi.org/10.1108/13565360910960213
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