Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints
- Author
- DU, X. N1 ; GUO, J. D1 ; SHANG, J. K1 2
[1] Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
[2] Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States - Source
Journal of electronic materials. 2009, Vol 38, Num 11, pp 2398-2404, 7 p ; ref : 20 ref
- CODEN
- JECMA5
- ISSN
- 0361-5235
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Springer, Heidelberg
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Author keyword
- Electromigration intermetallic compound solder joint
- Keyword (fr)
- Assemblage brasage tendre Composé intermétallique Courant électrique Cristal lamellaire Cuivre alliage Dépendance température Electrodiffusion Epaisseur Etain alliage Mécanisme croissance Réaction interface 6630Q 8110A Brasure sans plomb Cu3Sn Cu6Sn5
- Keyword (en)
- Soldered joint Intermetallic compound Electric current Layered crystals Copper alloy Temperature dependence Electrodiffusion Thickness Tin alloy Growth mechanism Interface reaction Lead free solder
- Keyword (es)
- Junta soldada Compuesto intermetálico Corriente eléctrica Cobre aleación Electrodifusión Espesor Estaño aleación Mecanismo crecimiento Reacción interfase
- Keyword (de)
- Weichloetverbindung Intermetallische Verbindung Elektrischer Strom Kupferlegierung Elektrodiffusion Dicke Zinnlegierung Wachstumsmechanismus
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60F Transport properties of condensed matter (nonelectronic) / 001B60F30 Diffusion in solids / 001B60F30Q Electromigration
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A10 Methods of crystal growth; physics of crystal growth / 001B80A10A Theory and models of crystal growth; physics of crystal growth, crystal morphology and orientation
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Metals. Metallurgy Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22148945
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s11664-009-0917-x 
https://dx.doi.org/10.1007/s11664-009-0917-x
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