Integrated Thermal Modeling of Heterogeneous eCubes Stacked Devices
- Author
- JANCZYK, G1 ; BIENIEK, T1 ; GRABIEC, P1 ; SZYNKA, J1
[1] Institute of Electron Technology Al. Lotnikow 32/46, 02-668, Warsaw, Poland - Conference title
- 14th International workshop on thermal investigation of ICs and systems (therminic)
- Conference name
- International workshop on thermal investigation of ICs and systems (14 ; Rome 2008)
- Source
14th International workshop on thermal investigation of ICs and systems (therminic). 2008 ; 1Vol, pp 80-84, 5 p ; ref : 8 ref
- ISBN
- 978-2-35500-008-9
- Scientific domain
- Electronics; Mechanics acoustics
- Publisher
- EDA publishing, [S.l.]
- Publication country
- France
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Comportement thermique Conception système Evaluation performance Fiabilité Gestion température packaging électronique Langage description matériel informatique Système refroidissement
- Keyword (en)
- Thermal behavior System design Performance evaluation Reliability Thermal management (packaging) Hardware description languages Cooling system
- Keyword (es)
- Comportamiento térmico Concepción sistema Evaluación prestación Fiabilidad Sistema enfriamiento
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22320897
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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