Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
- Author
- CHAN, Y. C1 ; YANG, D1
[1] EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong-Kong - Source
Progress in materials science. 2010, Vol 55, Num 5, pp 428-475, 48 p ; ref : 127 ref
- CODEN
- PRMSAQ
- ISSN
- 0079-6425
- Scientific domain
- Geology; Mechanics acoustics; Metallurgy, welding; Condensed state physics
- Publisher
- Elsevier, Kidlington
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Brasage tendre Densité courant Diffusion thermique Effet Joule Effet contrainte Electrodiffusion Endommagement Fiabilité Interconnexion Mode rupture Packaging électronique Réaction interface Brasure
- Keyword (en)
- Soldering Current density Thermal diffusion Joule effect Stress effects Electrodiffusion Damaging Reliability Interconnection Fracture mode Electronic packaging Interface reaction Solder
- Keyword (es)
- Soldeo blando Densidad corriente Difusión térmica Efecto Joule Electrodifusión Deterioración Fiabilidad Interconexión Modo ruptura Packaging electrónico Reacción interfase
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03B Testing, measurement, noise and reliability
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22571526
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.pmatsci.2010.01.001 
https://dx.doi.org/10.1016/j.pmatsci.2010.01.001
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