3D LED and IC wafer level packaging
- Author
- LAU, John1 ; LEE, Ricky2 ; YUEN, Matthew2 ; CHAN, Philip2
[1] Industrial Technology Research Institute, Hsinchu, Taiwan, Province of China
[2] Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong-Kong - Source
Microelectronics international. 2010, Vol 27, Num 2, pp 98-105, 8 p ; ref : 1 p.1/2
- ISSN
- 1356-5362
- Scientific domain
- Electronics
- Publisher
- MCB University Press, Bradford
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Author keyword
- Integrated circuits Light-emitting diodes Packaging
- Keyword (fr)
- Capteur mesure Circuit intégré Circuit à la demande Commande puissance Comportement thermique Diode électroluminescente Electronique puissance Evaluation performance Excitateur Facteur forme Gestion température packaging électronique Mesure fréquence Packaging électronique Processeur Radiofréquence Structure 3 dimensions 0707D Encapsulation sur tranche Dispositif optoélectronique
- Keyword (en)
- Measurement sensor Integrated circuit Custom circuit Power control Thermal behavior Light emitting diode Power electronics Performance evaluation Driver Form factor Thermal management (packaging) Frequency measurement Electronic packaging Processor Radiofrequency Three dimensional structure Wafer-level packaging Optoelectronic device
- Keyword (es)
- Captador medida Circuito integrado Circuito integrato personalizado Control potencia Comportamiento térmico Diodo electroluminescente Electrónica potencia Evaluación prestación Excitador Factor forma Medición frecuencia Packaging electrónico Procesador Radiofrecuencia Estructura 3 dimensiones Dispositivo optoelectrónico
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G07 General equipment and techniques / 001B00G07D Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06B Integrated circuits by function (including memories and processors)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F15 Optoelectronic devices
- Discipline
- Electronics Metrology
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22853328
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1108/13565361011034786 
https://dx.doi.org/10.1108/13565361011034786
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