Modular Test Facility for HTS Insert Coils
- Author
- LOMBARDO, V1 ; BARTALESI, A1 ; BARZI, E1 ; LAMM, M1 ; TURRIONI, D1 ; ZLOBIN, A. V1
[1] Fermi National Accelerator Laboratory, Batavia IL 60510, United States - Conference title
- THE TWENTY-FIRST INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Hefei, Anhui, China, October 18-23, 2009
- Conference name
- International Conference on Magnet Technology (MT) (MT) (21 ; Hefei, Anhui 2009-10-18)
- Author (monograph)
- Institute of Electrical and Electronic Engineers (IEEE), New York, NY, United States (Organiser of meeting)
- Source
IEEE transactions on applied superconductivity. 2010, Vol 20, Num 3, pp 587-591, 5 p ; ref : 11 ref
- ISSN
- 1051-8223
- Scientific domain
- Electronics; Electrical engineering
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Author keyword
- 2G HTS YBCO conductor High field solenoids high temperature superconductors muon collider
- Keyword (fr)
- Bobine supraconductrice Champ extérieur Champ intense Champ magnétique Electroaimant courant continu Evaluation performance Force Lorentz Gestion température packaging électronique Installation essai Refroidissement Solénoïde Supraconducteur haute température Système refroidissement
- Keyword (en)
- Superconducting coils External field High field Magnetic field Direct current magnet Performance evaluation Lorentz force Thermal management (packaging) Test facility Cooling Solenoid High temperature superconductor Cooling system
- Keyword (es)
- Campo exterior Campo intenso Campo magnético Electroimán corriente continua Evaluación prestación Fuerza Lorentz Instalación ensayo Enfriamiento Solenoide Supraconductor alta temperatura Sistema enfriamiento
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D05 Electrical engineering. Electrical power engineering / 001D05G Various equipment and components / 001D05G01 Electromagnets
- Discipline
- Electrical engineering. Electroenergetics Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 22862595
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TASC.2010.2045489 
https://dx.doi.org/10.1109/TASC.2010.2045489
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TASC.2010.2045489\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"2010\";s:9:\"\u0000*\u0000volume\";s:2:\"20\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"587\";s:8:\"\u0000*\u0000epage\";s:3:\"591\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"LOMBARDO\";s:10:\"\u0000*\u0000aufirst\";s:1:\"V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:12:\"BARTALESI, A\";i:1;s:8:\"BARZI, E\";i:2;s:7:\"LAMM, M\";i:3;s:11:\"TURRIONI, D\";i:4;s:12:\"ZLOBIN, A. V\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:104:\"THE TWENTY-FIRST INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Hefei, Anhui, China, October 18-23, 2009\";s:8:\"\u0000*\u0000title\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"5\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TASC.2010.2045489\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"2010\";s:9:\"\u0000*\u0000volume\";s:2:\"20\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"587\";s:8:\"\u0000*\u0000epage\";s:3:\"591\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"LOMBARDO\";s:10:\"\u0000*\u0000aufirst\";s:1:\"V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:12:\"BARTALESI, A\";i:1;s:8:\"BARZI, E\";i:2;s:7:\"LAMM, M\";i:3;s:11:\"TURRIONI, D\";i:4;s:12:\"ZLOBIN, A. V\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:104:\"THE TWENTY-FIRST INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Hefei, Anhui, China, October 18-23, 2009\";s:8:\"\u0000*\u0000title\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"5\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TASC.2010.2045489\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TASC.2010.2045489\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"2010\";s:9:\"\u0000*\u0000volume\";s:2:\"20\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"587\";s:8:\"\u0000*\u0000epage\";s:3:\"591\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"LOMBARDO\";s:10:\"\u0000*\u0000aufirst\";s:1:\"V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:12:\"BARTALESI, A\";i:1;s:8:\"BARZI, E\";i:2;s:7:\"LAMM, M\";i:3;s:11:\"TURRIONI, D\";i:4;s:12:\"ZLOBIN, A. V\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:104:\"THE TWENTY-FIRST INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Hefei, Anhui, China, October 18-23, 2009\";s:8:\"\u0000*\u0000title\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"5\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:11:\"BaseOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TASC.2010.2045489\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"2010\";s:9:\"\u0000*\u0000volume\";s:2:\"20\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"587\";s:8:\"\u0000*\u0000epage\";s:3:\"591\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"LOMBARDO\";s:10:\"\u0000*\u0000aufirst\";s:1:\"V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:12:\"BARTALESI, A\";i:1;s:8:\"BARZI, E\";i:2;s:7:\"LAMM, M\";i:3;s:11:\"TURRIONI, D\";i:4;s:12:\"ZLOBIN, A. V\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:104:\"THE TWENTY-FIRST INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Hefei, Anhui, China, October 18-23, 2009\";s:8:\"\u0000*\u0000title\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"5\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Base Search access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1109\/TASC.2010.2045489\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:9:\"\u0000*\u0000jtitle\";s:46:\"IEEE transactions on applied superconductivity\";s:9:\"\u0000*\u0000stitle\";s:27:\"IEEE trans. appl. supercond\";s:7:\"\u0000*\u0000date\";s:4:\"2010\";s:9:\"\u0000*\u0000volume\";s:2:\"20\";s:8:\"\u0000*\u0000issue\";s:1:\"3\";s:8:\"\u0000*\u0000spage\";s:3:\"587\";s:8:\"\u0000*\u0000epage\";s:3:\"591\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1051-8223\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:8:\"LOMBARDO\";s:10:\"\u0000*\u0000aufirst\";s:1:\"V\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:5:{i:0;s:12:\"BARTALESI, A\";i:1;s:8:\"BARZI, E\";i:2;s:7:\"LAMM, M\";i:3;s:11:\"TURRIONI, D\";i:4;s:12:\"ZLOBIN, A. V\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:104:\"THE TWENTY-FIRST INTERNATIONAL CONFERENCE ON MAGNET TECHNOLOGY, Hefei, Anhui, China, October 18-23, 2009\";s:8:\"\u0000*\u0000title\";s:42:\"Modular Test Facility for HTS Insert Coils\";s:8:\"\u0000*\u0000place\";s:12:\"New York, NY\";s:6:\"\u0000*\u0000pub\";s:49:\"Institute of Electrical and Electronics Engineers\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"5\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
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