Effect of Alloying Interlayer on Interfacial Bond Strength of CuW/CuCr Integral Materials
- Autor
- XIAOHONG YANG1 ; JUNTAO ZOU1 ; SHUHUA LIANG1 ; PENG XIAO1 ; ZHIKANG FAN1
[1] Shaanxi Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi'an University of Technology, Xi'an, 710048, China - Fuente
Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2010, Vol 527, Num 21-22, pp 5631-5636, 6 p ; ref : 14 ref
- Editor
- Elsevier, Kidlington
- País de la publicación
- United Kingdom
- Tipo de documento
- Article
- Idioma
- English
- Palabra clave de autor
- CuW/CuCr dissimilar material alloying interlayer interfacial bond strength interfacial microstructure microhardness
- Palabra clave (fr)
- Chrome alliage Couche interfaciale Cuivre alliage Essai traction Fer alliage Frittage Matériaux dissemblables Microdureté Microscopie optique Microscopie électronique balayage Microstructure Métal transition alliage Réaction interface Résistance traction Spectrométrie dispersive Tungstène alliage
- Palabra clave (in)
- Chromium alloys Interfacial layer Copper alloys Tensile tests Iron alloys Sintering Dissimilar materials Microhardness Optical microscopy Scanning electron microscopy Microstructure Transition element alloys Interface reaction Tensile strength Dispersive spectrometry Tungsten alloys
- Palabra clave (es)
- Capa interfacial Materiales desemejantes Reacción interfase Espectrometría dispersiva
- Clasificación
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60B Mechanical and acoustical properties of condensed matter / 001B60B20 Mechanical properties of solids / 001B60B20F Deformation and plasticity (including yield, ductility, and superplasticity)
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35F Diffusion; interface formation
- Disciplina
- Physics of condensed state : structure, mechanical and thermal properties
- Procedencia
- Inist-CNRS
- Base de datos
- PASCAL
- Identificador INIST
- 23078271
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.msea.2010.05.041 
https://dx.doi.org/10.1016/j.msea.2010.05.041
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