Effect of Grain Size on Pressure-Induced Tin Whisker Formation : Tin whiskers
- Author
- SHIBUTANI, Tadahiro1
[1] Faculty of Environment and Information Sciences, Yokohama National University, Yokohama 240-8501, Japan - Source
IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 177-182, 6 p ; ref : 17 ref
- CODEN
- ITEPFL
- ISSN
- 1521-334X
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Grain size hillock indentation pressure tin whisker
- Keyword (fr)
- Croissance cristalline Effet pression Energie surface Etain Grosseur grain Interconnexion Méthode numérique Méthode élément fini Nanoindentation Nucléation Trichite
- Keyword (en)
- Crystal growth Pressure effect Surface energy Tin Grain size Interconnection Numerical method Finite element method Nanoindentation Nucleation Whisker
- Keyword (es)
- Crecimiento cristalino Efecto presión Energía superficie Estaño Grosor grano Interconexión Método numérico Método elemento finito Nanoindentacion Nucleación Triquito
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 23213167
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/TEPM.2010.2042060 
https://dx.doi.org/10.1109/TEPM.2010.2042060
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