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Effect of Grain Size on Pressure-Induced Tin Whisker Formation : Tin whiskers

Author
SHIBUTANI, Tadahiro1
[1] Faculty of Environment and Information Sciences, Yokohama National University, Yokohama 240-8501, Japan
Source

IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 177-182, 6 p ; ref : 17 ref

CODEN
ITEPFL
ISSN
1521-334X
Scientific domain
Electronics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Article
Language
English
Author keyword
Grain size hillock indentation pressure tin whisker
Keyword (fr)
Croissance cristalline Effet pression Energie surface Etain Grosseur grain Interconnexion Méthode numérique Méthode élément fini Nanoindentation Nucléation Trichite
Keyword (en)
Crystal growth Pressure effect Surface energy Tin Grain size Interconnection Numerical method Finite element method Nanoindentation Nucleation Whisker
Keyword (es)
Crecimiento cristalino Efecto presión Energía superficie Estaño Grosor grano Interconexión Método numérico Método elemento finito Nanoindentacion Nucleación Triquito
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
23213167

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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