Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder
- Author
- XIAOYING LIU1 ; MINGLIANG HUANG1 ; WU, C. M. L2 ; LAI WANG1
[1] Department of Materials Engineering, Dalian University of Technology, Liaoning, China
[2] Department of Physics and Materials Science, City University of Hongkong, Hong-Kong - Source
Journal of materials science. Materials in electronics. 2010, Vol 21, Num 10, pp 1046-1054, 9 p ; ref : 21 ref
- ISSN
- 0957-4522
- Scientific domain
- Electronics; Condensed state physics
- Publisher
- Springer, Norwell, MA
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Alliage eutectique Assemblage brasage tendre Assemblage circuit intégré Cisaillement Composé intermétallique Cuivre Energie activation Essai cisaillement Etat solide Matériau composite Microstructure Miniaturisation Nucléation Oxyde d'yttrium Vieillissement thermique 6460Q 6865 Brasure Y2O3
- Keyword (en)
- Eutectic alloy Soldered joint Integrated circuit bonding Shear Intermetallic compound Copper Activation energy Shear test Solid state Composite material Microstructure Miniaturization Nucleation Yttrium oxide Thermal ageing Solder
- Keyword (es)
- Aleación eutéctica Junta soldada Cizalladura Compuesto intermetálico Cobre Energía activación Ensayo cortante Estado sólido Material compuesto Microestructura Miniaturización Nucleación Ytrio óxido Envejecimiento térmico
- Keyword (de)
- Eutektische Legierung Weichloetverbindung Scherung Intermetallische Verbindung Kupfer Aktivierungsenergie Scherpruefung Fester Zustand Verbundwerkstoff Mikrogefuege Miniaturisierung Yttriumoxid
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H65 Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A40 Treatment of materials and its effects on microstructure and properties / 001B80A40C Solid solution, precipitation, and dispersion hardening; aging
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Electronics Metals. Metallurgy Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 23362781
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s10854-009-0025-y 
https://dx.doi.org/10.1007/s10854-009-0025-y
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