Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future
- Author
- CALIMERA, A1 ; MACII, A1 ; MACII, E1 ; RINAUDO, S2 ; PONCINO, M1
[1] Politecnico di Torino, 10129, Torino, Italy
[2] STMircoelectronics, 95121, Catania, Italy - Conference title
- 16th international workshop on THERMal INvestigations of ICs and systems (Barcelona, Spain, 6-8 October 2010)
- Conference name
- International workshop on thermal investigations of ICs and systems (16 ; Barcelona 2010)
- Author (monograph)
- Courtois, Bernard (Editor); Rencz, Marta (Editor)
CMP-CNRS-INPG-UIF, France (Organiser of meeting)
IEEE, United States (Organiser of meeting)
IEEE, Components, Packaging and Manufacturing Technology Society, United States (Organiser of meeting) - Source
16th international workshop on THERMal INvestigations of ICs and systems (Barcelona, Spain, 6-8 October 2010). 2010 ; 1Vol, pp 171-176, 6 p ; ref : 29 ref
- ISBN
- 978-2-35500-012-6
- Scientific domain
- Electronics; Metrology and instrumentation
- Publisher
- EDA publishing, Grenoble
- Publication country
- France
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Alimentation électrique Circuit électronique Comportement thermique Composant électronique Conception système Dissipateur thermique Défaillance Effet Joule Effet température Electronique puissance Endommagement Fiabilité Gestion température packaging électronique Haute température Modèle thermique Modélisation Packaging électronique Système refroidissement Technologie MOS complémentaire
- Keyword (en)
- Power supply Electronic circuit Thermal behavior Electronic component System design Heat sink Failures Joule effect Temperature effect Power electronics Damaging Reliability Thermal management (packaging) High temperature Thermal model Modeling Electronic packaging Cooling system Complementary MOS technology
- Keyword (es)
- Alimentación eléctrica Circuito electrónico Comportamiento térmico Componente electrónico Concepción sistema Disipador térmico Fallo Efecto Joule Efecto temperatura Electrónica potencia Deterioración Fiabilidad Alta temperatura Modelo térmico Modelización Packaging electrónico Sistema enfriamiento Tecnología MOS complementario
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D05 Electrical engineering. Electrical power engineering / 001D05H Power electronics, power supplies
- Discipline
- Electrical engineering. Electroenergetics Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 23478372
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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