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A Novel Silicon-containing Ethynylarene Resin as Heat-resistant Thermoset

Author
SONG SHI1 2 ; MING YANG3 ; ZHENHUA LUO3 ; WEIJIAN HAN3 ; JIDONG HU2 ; TONG ZHAO3 ; DAHAI ZHANG1 2
[1] Tianjin Polytechnic University, Tianjin 300160, China
[2] National Key Laboratory of Advanced Functional Composite Materials ,Aerospace Reserch Institute of Materials & Processing Technology, Beijing 100076, China
[3] Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
Source

Polymers & polymer composites. 2011, Vol 19, Num 2-3, pp 141-147, 7 p ; ref : 15 ref

ISSN
0967-3911
Scientific domain
Polymers, paint and wood industries
Publisher
Rapra, Shrewsbury
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Composé polyynique Durcissement (matière plastique) Effet température Etude expérimentale Polycondensation Polymère conducteur Polymère conjugué Propriété thermique Préparation Silane copolymère Stabilité thermique Structure moléculaire Thermodurcissable
Keyword (en)
Polyynic compound Curing (plastics) Temperature effect Experimental study Condensation polymerization Conducting polymers Conjugated polymer Thermal properties Preparation Silane copolymer Thermal stability Molecular structure Thermosetting resin
Keyword (es)
Compuesto poliínico Endurecimiento (material plástico) Efecto temperatura Estudio experimental Policondensación Polímero conjugado Propiedad térmica Preparación Silano copolímero Estabilidad térmica Estructura molecular Termoestable
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers / 001D09E Inorganic and organomineral polymers / 001D09E01 Preparation

Discipline
Physical chemistry of polymers
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
24009618

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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