Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma
- Author
- ZIMMERMANN, S1 ; AHNER, N1 ; BLASCHTA, F1 ; SCHALLER, M2 ; ZIMMERMANN, H3 ; RÜLKE, H2 ; LANG, N3 ; RÖPCKE, J3 ; SCHULZ, S. E1 4 ; GESSNER, T1 4
[1] Fraunhofer ENAS, Department Back-end of Line, Technologie-Campus 3, 09126 Chemnitz, Germany
[2] Globalfoundries Dresden Module Two GmbH & Co., KG, Dresden, Germany
[3] INP Greifswald e.V., Greifswald, Germany
[4] Chemnitz University of Technology, Center for Microtechnologies, 09107 Chemnitz, Germany - Conference title
- The 2010 International workshop on Materials for Advanced Metallization - MAM 2010
- Conference name
- International workshop on Materials for Advanced Metallization, MAM 2010 (19 ; Mechelen, Malines 2010-03-07)
- Author (monograph)
- TRAVALY, Youssef (Editor)1 ; DETAVERNIER, Christophe (Editor)2
[1] IMEC, Belgium
[2] Gend University, Belgium - Source
Microelectronic engineering. 2011, Vol 88, Num 5, pp 671-676, 6 p ; ref : 15 ref
- CODEN
- MIENEF
- ISSN
- 0167-9317
- Scientific domain
- Electronics
- Publisher
- Elsevier, Amsterdam
- Publication country
- Netherlands
- Document type
- Conference Paper
- Language
- English
- Author keyword
- Contact angle measurements Flourocarbon plasma Plasma etch Quadrupole mass spectrometry Quantum cascade laser absorption SiCOH spectroscopy
- Keyword (fr)
- Additif Addition carbone Addition hydrogène Angle contact Argon Article synthèse Carbone Cathode Circuit intégré Constante diélectrique Diélectrique basse permittivité Ellipsométrie spectroscopique Endommagement Fabrication microélectronique Fluor Gravure ionique réactive Hydrocarbure fluoré Interconnexion Ion lourd Laser cascade quantique Loi échelle Matériau dopé Mercure Microscopie électronique balayage Oxyde de silicium Polymérisation Spectrométrie FTIR Spectrométrie absorption Spectrométrie masse Traitement par plasma Vitesse gravure 0779 4255P 7840R 8540H SiOCH
- Keyword (en)
- Additive Carbon addition Hydrogen additions Contact angle Argon Review Carbon Cathode Integrated circuit Permittivity Low k dielectric Spectroscopic ellipsometry Damaging Microelectronic fabrication Fluorine Reactive ion etching Fluorocarbon Interconnection Heavy ion Quantum cascade laser Scaling law Doped materials Mercury Scanning electron microscopy Silicon oxides Polymerization Fourier-transformed infrared spectrometry Absorption spectrometry Mass spectrometry Plasma assisted processing Etching rate
- Keyword (es)
- Aditivo Adición carbono Angulo contacto Argón Artículo síntesis Carbono Cátodo Circuito integrado Constante dieléctrica Dieléctrico baja constante dieléctrica Elipsometría espectroscópica Deterioración Fabricación microeléctrica Fluor Grabado iónico reactivo Hidrocarburo fluorado Interconexión Ión pesado Ley escala Mercurio Microscopía electrónica barrido Polimerización Espectrometría FTIR Espectrometría absorción Espectrometría masa Velocidad grabado
- Keyword (de)
- Zusatzstoff Kohlenstoffzusatz Kontaktwinkel Argon Kohlenstoff Kathode Integrierte Schaltung Dielektrizitaetskonstante Fluor Quecksilber Rasterelektronenmikroskopie Absorptionsspektrometrie Massenspektrometrie
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B70 Condensed matter: electronic structure, electrical, magnetic, and optical properties / 001B70G Dielectrics, piezoelectrics, and ferroelectrics and their properties / 001B70G22 Dielectric properties of solids and liquids / 001B70G22C Permittivity (dielectric function)
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11G Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology / 001D11G05 Fractures
- Discipline
- Electronics Metals. Metallurgy Physics and materials science Physics of condensed state : electronic structure, electrical, magnetic and optical properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 24013555
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.mee.2010.07.001 
https://dx.doi.org/10.1016/j.mee.2010.07.001
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