Electrochemical process for advanced package fabrication
- Author
- KRONGELB, S1 ; ROMANKIW, T1 ; TORNELLO, A1
[1] IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, United States - Source
IBM journal of research and development. 1998, Vol 42, Num 5, pp 575-585 ; ref : 21 ref
- CODEN
- IBMJAE
- ISSN
- 0018-8646
- Scientific domain
- Electronics; Computer science
- Publisher
- International Business Machines, Armonk, NY
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Boîtier Cuivre Dépôt par oxydoréduction Electrolyte Etude expérimentale Fabrication microélectronique Méthode électrochimique Placage
- Keyword (en)
- Package Copper Electroless plating Electrolyte Experimental study Microelectronic fabrication Electrochemical method Plating
- Keyword (es)
- Estuche Cobre Depósito por oxidorreducción Electrolito Estudio experimental Fabricación microeléctrica Método electroquímico Enchapado
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 2421717
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1147/rd.425.0575 
https://dx.doi.org/10.1147/rd.425.0575
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