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Emergence of strain-rate sensitivity in Cu nanopillars: Transition from dislocation multiplication to dislocation nucleation

Author
JENNINGS, Andrew T1 ; JU LI2 ; GREER, Julia R1
[1] Division of Engineering and Applied Science, California Institute of Technology, 1200 E. California Blvd, Pasadena, CA 91125, United States
[2] Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA 19104, United States
Source

Acta materialia. 2011, Vol 59, Num 14, pp 5627-5637, 11 p ; ref : 63 ref

ISSN
1359-6454
Scientific domain
Metallurgy, welding; Condensed state physics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Author keyword
Compression test Copper Nanostructure Theory
Keyword (fr)
Dislocation Essai compression Germination dislocation Nanostructure Propriété mécanique Sensibilité vitesse déformation Vitesse déformation
Keyword (en)
Dislocation Compression test Dislocation nucleation Nanostructure Mechanical properties Strain rate sensitivity Strain rate
Keyword (es)
Dislocación Ensayo compresión Germinación dílocación Nanoestructura Propiedad mecánica Sensibilidad velocidad deformación Velocidad deformación
Keyword (de)
Versetzung Druckversuch Versetzungskeimbildung Dehngeschwindigkeitsempfindlichkeit Verformungsgeschwindigkeit
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11A General

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11G Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology

Discipline
Metals. Metallurgy
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
24384477

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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