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Through-Oxide-Via-Induced Back-Gate Effect in 3-D Integrated FDSOI Devices

Author
AMIT RANJAN TRIVEDI1 ; MUKHOPADHYAY, Saibal1
[1] School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States
Source

IEEE electron device letters. 2011, Vol 32, Num 8, pp 1020-1022, 3 p ; ref : 8 ref

CODEN
EDLEDZ
ISSN
0741-3106
Scientific domain
Electronics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Article
Language
English
Author keyword
3-D integration Fully depleted silicon-on-insulator (FDSOI) through-oxide via (TOV)
Keyword (fr)
Caractéristique électrique Champ électrique Circuit intégré Couche appauvrissement Courant fuite Empilement Interconnexion Seuil tension Structure 3 dimensions Surtension Technologie silicium sur isolant Transistor Trou interconnexion
Keyword (en)
Electrical characteristic Electric field Integrated circuit Depletion layer Leakage current Stacking Interconnection Voltage threshold Three dimensional structure Overvoltage Silicon on insulator technology Transistor Via hole
Keyword (es)
Característica eléctrica Campo eléctrico Circuito integrado Capa empobrecimiento Corriente escape Apilamiento Interconexión Umbral tensión Estructura 3 dimensiones Sobrevoltaje Tecnología silicio sobre aislante Transistor Agujero interconexión
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F04 Transistors

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
24415918

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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