Modified imprinting process using hollow microneedle array for forming through holes in polymers
- Author
- SHIBATA, Takayuki1 ; YUKIZONO, Satoshi1 ; KAWASHIMA, Takahiro1 ; NAGAI, Moeto1 ; KUBOTA, Toshio2 ; MITA, Mamoru3
[1] Department of Mechanical Engineering, Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku-cho, Toyohashi, Aichi 441-8580, Japan
[2] Department of Biomolecular Functional Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Ibaraki 316-8511, Japan
[3] MEPJ Co., Ltd., 4-17-1 Suwa-cho, Hitachi, Ibaraki 316-0001, Japan - Conference title
- MNE 2010: Proceedings of the 36th International Conference on Micro- and Nano-Engineering (MNE)
- Conference name
- International Conference on Micro- and Nano-Engineering (MNE) (MNE) (36 ; Genoa 2010-09-19)
- Author (monograph)
- DE VITTORIO, Massimo (Editor); GENTILI, Massimo (Editor); GERARDINO, Annamaria (Editor); LORENZELLI, Leandro (Editor); MARTIRADONNA, Luigi (Editor); PINGUE, Pasqualantonio (Editor)
- Source
Microelectronic engineering. 2011, Vol 88, Num 8, pp 2121-2125, 5 p ; ref : 10 ref
- CODEN
- MIENEF
- ISSN
- 0167-9317
- Scientific domain
- Electronics
- Publisher
- Elsevier, Amsterdam
- Publication country
- Netherlands
- Document type
- Conference Paper
- Language
- English
- Author keyword
- Flexible printed circuit (FPC) boards High-density interconnects (HDI) Hollow microneedle array Micro-hole processing Microelectromechanical systems (MEMS) Polymer through holes Thermal imprinting process
- Keyword (fr)
- Carte électronique Circuit imprimé souple Circuit imprimé Circuit intégré Densité élevée Diminution coût Dispositif microélectromécanique Epaisseur Imide polymère Interconnexion Oxyde de silicium Polymère Propène polymère Réseau (arrangement) Traitement matériau Trou interconnexion 8105L SiO2 Composé IV-VI
- Keyword (en)
- Printed circuit board Flexible printed circuit board Printed circuit Integrated circuit High density Cost lowering Microelectromechanical device Thickness Polyimide Interconnection Silicon oxides Polymer Propylene polymer Array Material processing Via hole IV-VI compound
- Keyword (es)
- Tarjeta electronica Circuito imprimido flexible Circuito imprimido Circuito integrado Densidad elevada Reducción costes Dispositivo microelectromecánico Espesor Imida polímero Interconexión Polímero Propeno polímero Red Tratamiento material Agujero interconexión Compuesto IV-VI
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A05 Specific materials / 001B80A05Z Other materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F21 Micro- and nanoelectromechanical devices (mems/nems)
- Discipline
- Electronics Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 24458714
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.mee.2010.12.048 
https://dx.doi.org/10.1016/j.mee.2010.12.048
