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Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach

Author
LOFRANO, M1 ; CROES, K1 ; DE WOLF, I1 2 ; WILSON, C. J1
[1] Imec, Kapeldreef 75, 3001 Leuven, Belgium
[2] K.U. Leuven, Dept. MTM, Kasteelpark Arenberg 44 - Bus 2450, 3001 Leuven, Belgium
Conference title
Proceedings of the 22nd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2011)
Conference name
European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2011) (ESREF 2011) (22 ; Bordeaux 2011-10-03)
Author (monograph)
LABAT, N (Editor)1 ; MARC, F (Editor)1
[1] IMS, University of Bordeaux, France
Source

Microelectronics and reliability. 2011, Vol 51, Num 9-11, pp 1578-1581, 4 p ; ref : 13 ref

CODEN
MCRLAS
ISSN
0026-2714
Scientific domain
Electronics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Conference Paper
Language
English
Keyword (fr)
Appareillage essai Défaillance Effet contrainte Modélisation Méthode numérique Méthode élément fini
Keyword (en)
Testing equipment Failures Stress effects Modeling Numerical method Finite element method
Keyword (es)
Aparato ensayo Fallo Modelización Método numérico Método elemento finito
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03B Testing, measurement, noise and reliability

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
24618517

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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