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The Influence of Adhesive Materials on Chip-On-Board Packing of MEMS Microphone

Author
CHUANG, Cheng-Hsin1 ; HUANG, Yi-Hsuan1 ; LEE, Shin-Li2
[1] Department of Mechanical Engineering, Southern Taiwan University No. 1, Nantai St., Yung-Kang City, Tainan, Taiwan, Province of China
[2] Micro System Technology Center, Institute Technology Research Institute Southern, Tainan, Taiwan, Province of China
Conference title
Symposium on design, test, integration and packaging of MEMS-MOEMS (11-13 May 2011, Aix-enProvence, France)
Conference name
Symposium on design, test, integration and packaging of MEMS-MOEMS (Aix-en-Provence 2011-05-11)
Author (monograph)
Courtois, Bernard (Editor); Karam, Jean Michel (Editor); Liu, Aiqun (Editor)
Source

Symposium on design, test, integration and packaging of MEMS-MOEMS (11-13 May 2011, Aix-enProvence, France). 2011 ; 1Vol, pp 122-127, 6 p ; ref : 7 ref

ISBN
978-2-355-00013-3
Scientific domain
Metrology and instrumentation
Publisher
EDA, Grenoble
Publication country
France
Document type
Conference Paper
Language
English
Keyword (fr)
Brasage avec refusion Carte électronique Contrainte thermique Diaphragme Dilatation thermique Dispositif microélectromécanique Déformation thermique Désadaptation Effet température Etude théorique Matrice formage Matériau adhésif Matériau dur Microphone Montage surface composant Multicouche Méthode élément fini Nickel Packaging électronique Polymère cristal liquide Silicium Technologie puce sur carte 8540 8585
Keyword (en)
Reflow soldering Printed circuit board Thermal stress Diaphragm Thermal expansion Microelectromechanical device Thermal strain Mismatching Temperature effect Theoretical study Die Adhesive material Hard material Microphone Surface mount technology Multiple layer Finite element method Nickel Electronic packaging Liquid crystal polymers Silicon Chip-on-board packaging
Keyword (es)
Soldeo con refusión Tarjeta electronica Tensión térmica Diafragma Dilatación térmica Dispositivo microelectromecánico Deformación térmica Desadaptación Efecto temperatura Estudio teórico Matriz formadora Material adhesivo Material duro Micrófono Montaje superficie componente Capa múltiple Método elemento finito Niquel Packaging electrónico Silicio
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03D Electronic equipment and fabrication. Passive components, printed wiring boards, connectics

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F21 Micro- and nanoelectromechanical devices (mems/nems)

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
25499930

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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