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The Effect of Epoxy Resin to Reduce the Compression Set of Polysulfide Sealant

Author
JUNSHENG ZHANG1 ; ZHENGHEI WANG1 ; GUOWEI DING1 ; YIWU QUAN1 ; QINGMIN CHEN1
[1] Department of Polymer Science and Engineering, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210093, China
Source

Journal of applied polymer science. 2012, Vol 125, Num 1, pp 390-395, 6 p ; ref : 22 ref

CODEN
JAPNAB
ISSN
0021-8995
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley, Hoboken, NJ
Publication country
United States
Document type
Article
Language
English
Author keyword
compression set epoxy resin polysulfide resin sealant
Keyword (fr)
Copolymère soufre Elastomère Epoxyde résine Ether copolymère Etude expérimentale Matériau étanchéité Mélange polymère Propriété mécanique Relation contrainte déformation Résistance compression Silice Vulcanisat Vulcanisation
Keyword (en)
Sulfur copolymer Elastomer Epoxy resin Ether copolymer Experimental study Sealing material Polymer blends Mechanical properties Stress strain relation Compressive strength Silica Vulcanizate Vulcanization
Keyword (es)
Copolímero azufre Elastómero Epóxido resina Eter copolímero Estudio experimental Material estanqueidad Propiedad mecánica Relación tensión deformación Resistencia compresión Sílice Vulcanizado Vulcanización
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06H Composites

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
25796054

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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