Modular sensor chip design for package stress evaluation and reliability characterisation
- Author
- TRIGG, A. D1 ; CHAI TAI CHONG1 ; ZHANG XIAOWU1 ; CHEN XIAN TONG1 ; LEONG CHING, Wai1
[1] Institute of Microelectronics, A'STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore - Conference name
- Symposium W of the International Conference on Materials for Advanced Technologies ICMAT 2011 (Singapore 2011-07-26)
- Source
Microelectronics and reliability. 2012, Vol 52, Num 8, pp 1581-1585, 5 p ; ref : 11 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Kidlington
- Publication country
- United Kingdom
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Action humidité Capteur mesure Circuit intégré Conception circuit intégré Conception modulaire Courant fuite Cuivre Fiabilité Interconnexion Microassemblage Microcâblage Moniteur Or Packaging électronique 0707D
- Keyword (en)
- Humidity effect Measurement sensor Integrated circuit Integrated circuit design Modular design Leakage current Copper Reliability Interconnection Microassembling Wire bonding Monitor Gold Electronic packaging
- Keyword (es)
- Acción humedad Captador medida Circuito integrado Concepción modular Corriente escape Cobre Fiabilidad Interconexión Micromontaje Unión por hilo Monitor Oro Packaging electrónico
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B00 General / 001B00G Instruments, apparatus, components and techniques common to several branches of physics and astronomy / 001B00G07 General equipment and techniques / 001B00G07D Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics Metrology
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 26172586
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.microrel.2012.01.012 
https://dx.doi.org/10.1016/j.microrel.2012.01.012
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