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Influence of Layer Thickness on the Performance of Stacked Thick-Film Copper Air-Core Power Inductors

Author
MEYER, Christopher D1 2 ; BEDAIR, Sarah S1 ; MORGAN, Brian C1 ; ARNOLD, David P2
[1] U.S. Army Research Laboratory, Adelphi, MD 20814, United States
[2] Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL 32611, United States
Conference title
Selected papers from the 2012 IEEE International Magnetics (INTERMAG) Conference, Vancouver, Canada, May 7-11, 2012
Conference name
INTERMAG'2011 IEEE International Magnetics Conference (Vancouver, BC 2012-05-07)
Author (monograph)
Institute of Electrical and Electronics Engineers (IEEE), New York, NY, United States (Organiser of meeting)
Source

IEEE transactions on magnetics. 2012, Vol 48, Num 11, pp 4436-4439, 4 p ; ref : 21 ref

CODEN
IEMGAQ
ISSN
0018-9464
Scientific domain
Electronics; Metallurgy, welding; Condensed state physics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Conference Paper
Language
English
Author keyword
Electromagnetic induction micromachining power integrated circuits thick-film inductors
Keyword (fr)
Air Bobine inductance Circuit intégré Couche épaisse Electronique Epaisseur couche Microusinage Propriété magnétique Application
Keyword (en)
Air Inductors Integrated circuits Thick films Electronics Layer thickness Micromachining Magnetic properties Application
Keyword (es)
Electrónica Espesor capa Aplicación
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A90 Other topics in materials science

Discipline
Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
26685729

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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