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The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Author
LI, Cai-Fu1 ; LIU, Zhi-Quan1 ; SHANG, Jian-Ku1
[1] Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Source

Journal of alloys and compounds. 2013, Vol 550, pp 231-238, 8 p ; ref : 30 ref

ISSN
0925-8388
Scientific domain
Inorganic chemistry; Crystallography; Metallurgy, welding; Condensed state physics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Author keyword
Growth mechanism Hillock NdSn3 Oxidation Tin whisker
Keyword (fr)
Effet température Etain alliage Extrusion Humidité Microscopie électronique balayage Microstructure Mécanisme croissance Néodyme alliage Oxydation Trichite
Keyword (en)
Temperature effects Tin alloys Extrusion Humidity Scanning electron microscopy Microstructure Growth mechanism Neodymium alloys Oxidation Whiskers
Keyword (es)
Mecanismo crecimiento
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A10 Methods of crystal growth; physics of crystal growth

Discipline
Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
27112858

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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