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The effects of DRIE operational parameters on vertically aligned micropillar arrays

Author
MILLER, Kane1 ; MINGXIAO LI1 ; WALSH, Kevin M2 ; FU, Xiao-An1
[1] Department of Chemical Engineering, University of Louisville, Louisville, KY 40208, United States
[2] Department of Electrical and Computer Engineering, University of Louisville, Louisville, KY 40208, United States
Source

Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 3 ; 035039.1-035039.6 ; ref : 22 ref

ISSN
0960-1317
Scientific domain
Electronics; Mechanical engineering
Publisher
Institute of Physics, Bristol
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Alignement vertical Formation motif Gravure ionique réactive Lithographie sans masque Microscopie électronique balayage Optimisation Passivation Photolithographie Profil profondeur Réseau(arrangement) Silicium Surface lisse
Keyword (en)
Vertical alignment Patterning Reactive ion etching Maskless lithography Scanning electron microscopy Optimization Passivation Photolithography Depth profiles Arrays Silicon Smooth surface
Keyword (es)
Alineacíon vertical Grabado iónico reactivo Litografía sin máscara Superficie lisa
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments

Discipline
Physics and materials science
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
27159163

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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