The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant
- Author
- DAHAN, Nathaniel1 ; DONALDSON, Nick1 ; TAYLOR, Stephen2 ; SERENO, Nuno3
[1] Implanted Devices Group, Department of Medical Physics and Bioengineering, University College London, Malet Place Engineering Building, Gower Street, London WC1E 6BT, United Kingdom
[2] IOMS, University College London, Royal National Orthopaedic Hospital Trust, Stanmore HA7 4LP, United Kingdom
[3] Invibio Ltd., IGTC, Hillhouse International, Thornton Cleveleys, Lancashire FY5 4QD, United Kingdom - Source
Journal of microelectronics and electronic packaging. 2013, Vol 10, Num 1, pp 15-22, 8 p ; ref : 20 ref
- ISSN
- 1551-4897
- Scientific domain
- Electronics
- Publisher
- International Microelectronics and Packaging Society, Washington, DC
- Publication country
- United States
- Document type
- Article
- Language
- English
- Author keyword
- Diffusion processes PEEK electronics packaging humidity measurement implantable biomedical devices polymers
- Keyword (fr)
- Cavité Composant électronique Durabilité Eau Etherethercétone polymère Fiabilité Gel silice Humidité relative Mesure humidité Packaging électronique Polymère Processus diffusion
- Keyword (en)
- Cavity Electronic component Durability Water Polyetheretherketone Reliability Silica gel Relative humidity Moisture measurement Electronic packaging Polymer Diffusion process
- Keyword (es)
- Cavidad Componente electrónico Durabilidad Agua Eter éter cetona polímero Fiabilidad Gel sílice Humedad relativa Medición humedad Packaging electrónico Polímero Proceso difusión
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 27325059
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.4071/imaps.346 
https://dx.doi.org/10.4071/imaps.346
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:17:\"10.4071\/imaps.346\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:9:\"\u0000*\u0000jtitle\";s:52:\"Journal of microelectronics and electronic packaging\";s:9:\"\u0000*\u0000stitle\";s:35:\"J. micronelectron. electron. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2013\";s:9:\"\u0000*\u0000volume\";s:2:\"10\";s:8:\"\u0000*\u0000issue\";s:1:\"1\";s:8:\"\u0000*\u0000spage\";s:2:\"15\";s:8:\"\u0000*\u0000epage\";s:2:\"22\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1551-4897\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:5:\"DAHAN\";s:10:\"\u0000*\u0000aufirst\";s:9:\"Nathaniel\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:3:{i:0;s:15:\"DONALDSON, Nick\";i:1;s:15:\"TAYLOR, Stephen\";i:2;s:12:\"SERENO, Nuno\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:8:\"\u0000*\u0000place\";s:14:\"Washington, DC\";s:6:\"\u0000*\u0000pub\";s:52:\"International Microelectronics and Packaging Society\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:17:\"10.4071\/imaps.346\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:9:\"\u0000*\u0000jtitle\";s:52:\"Journal of microelectronics and electronic packaging\";s:9:\"\u0000*\u0000stitle\";s:35:\"J. micronelectron. electron. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2013\";s:9:\"\u0000*\u0000volume\";s:2:\"10\";s:8:\"\u0000*\u0000issue\";s:1:\"1\";s:8:\"\u0000*\u0000spage\";s:2:\"15\";s:8:\"\u0000*\u0000epage\";s:2:\"22\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1551-4897\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:5:\"DAHAN\";s:10:\"\u0000*\u0000aufirst\";s:9:\"Nathaniel\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:3:{i:0;s:15:\"DONALDSON, Nick\";i:1;s:15:\"TAYLOR, Stephen\";i:2;s:12:\"SERENO, Nuno\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:8:\"\u0000*\u0000place\";s:14:\"Washington, DC\";s:6:\"\u0000*\u0000pub\";s:52:\"International Microelectronics and Packaging Society\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:17:\"10.4071\/imaps.346\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:17:\"10.4071\/imaps.346\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:9:\"\u0000*\u0000jtitle\";s:52:\"Journal of microelectronics and electronic packaging\";s:9:\"\u0000*\u0000stitle\";s:35:\"J. micronelectron. electron. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2013\";s:9:\"\u0000*\u0000volume\";s:2:\"10\";s:8:\"\u0000*\u0000issue\";s:1:\"1\";s:8:\"\u0000*\u0000spage\";s:2:\"15\";s:8:\"\u0000*\u0000epage\";s:2:\"22\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1551-4897\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:5:\"DAHAN\";s:10:\"\u0000*\u0000aufirst\";s:9:\"Nathaniel\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:3:{i:0;s:15:\"DONALDSON, Nick\";i:1;s:15:\"TAYLOR, Stephen\";i:2;s:12:\"SERENO, Nuno\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:8:\"\u0000*\u0000place\";s:14:\"Washington, DC\";s:6:\"\u0000*\u0000pub\";s:52:\"International Microelectronics and Packaging Society\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:7:\"journal\";s:6:\"\u0000*\u0000doi\";s:17:\"10.4071\/imaps.346\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:9:\"\u0000*\u0000jtitle\";s:52:\"Journal of microelectronics and electronic packaging\";s:9:\"\u0000*\u0000stitle\";s:35:\"J. micronelectron. electron. packag\";s:7:\"\u0000*\u0000date\";s:4:\"2013\";s:9:\"\u0000*\u0000volume\";s:2:\"10\";s:8:\"\u0000*\u0000issue\";s:1:\"1\";s:8:\"\u0000*\u0000spage\";s:2:\"15\";s:8:\"\u0000*\u0000epage\";s:2:\"22\";s:8:\"\u0000*\u0000pages\";s:0:\"\";s:7:\"\u0000*\u0000issn\";s:9:\"1551-4897\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:5:\"DAHAN\";s:10:\"\u0000*\u0000aufirst\";s:9:\"Nathaniel\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:3:{i:0;s:15:\"DONALDSON, Nick\";i:1;s:15:\"TAYLOR, Stephen\";i:2;s:12:\"SERENO, Nuno\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:7:\"article\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:158:\"The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with Desiccant\";s:8:\"\u0000*\u0000place\";s:14:\"Washington, DC\";s:6:\"\u0000*\u0000pub\";s:52:\"International Microelectronics and Packaging Society\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:1:\"8\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
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