Creep behavior of an epoxy resin cured under hydrostatic pressure
- Author
- JONG KEUN LEE1 ; PAE, K. D2
[1] Department of Polymer Science and Engineering, Kumoh National University of Technology, Kumi, Kyungbuk, 730-701, Korea, Republic of
[2] High Pressure Materials Research Laboratory and Department of Mechanical and Aerospace Engineering, Rutgers University, Piscataway, New Jersey 08855-0909, United States - Source
Journal of macromolecular science. Physics. 1997, Vol 36, Num 4, pp 475-485 ; ref : 8 ref
- CODEN
- JMAPBR
- ISSN
- 0022-2348
- Scientific domain
- Polymers, paint and wood industries
- Publisher
- Taylor & Francis, Philadelphia, PA
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Contrainte traction Courbe fluage Diamine Durcissement(matière plastique) Effet pression Epoxyde résine Etude expérimentale Polymère réticulé Polymérisation sous pression Pression hydrostatique Relation mise en œuvre propriété Complaisance fluage Propriété rhéologique
- Keyword (en)
- Tensile stress Creep curve Diamine Curing(plastics) Pressure effect Epoxy resin Experimental study Crosslinked polymer Polymerization under pressure Hydrostatic pressure Property processing relationship Rheological properties
- Keyword (es)
- Tensión traccíon Curva fluencia Diamina Endurecimiento(material plástico) Efecto presión Epóxido resina Estudio experimental Polímero reticulado Polimerización bajo presión Presión hidrostática Relación puesta en marcha propiedad Propiedad rheológica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers / 001D09D Organic polymers / 001D09D04 Properties and characterization / 001D09D04A Rheology and viscoelasticity
- Discipline
- Physical chemistry of polymers
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 2741414
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1080/00222349708220436 
https://dx.doi.org/10.1080/00222349708220436
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