Modelling methodology for thermal analysis of hot solder dip process : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
- Author
- STOYANOV, Stoyan1 ; BAILEY, Chris1 ; ALAM, M. O1 ; CHUNYAN YIN1 ; BEST, Chris2 ; TOLLAFIELD, Peter3 ; CRAWFORD, Rob3 ; PARKER, Mike3 ; SCOTT, Jim4
[1] Computational Mechanics and Reliability Group, University of Greenwich, London SE10 9LS, United Kingdom
[2] School of Engineering, University of Greenwich, Chatham Kent ME4 4TB, United Kingdom
[3] Micross Components Ltd., 11-16 A-Tech Court, Lancasterfields Crewe CW1 6FF, United Kingdom
[4] SELEX Galileo Ltd., Crewe Toll, Ferry Road, Edinburgh EH5 2XS, United Kingdom - Conference name
- EuroSimE 2012 International Conference (13 ; Cascais 2012-04-16)
- Source
Microelectronics and reliability. 2013, Vol 53, Num 8, pp 1055-1067, 13 p ; ref : 21 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Kidlington
- Publication country
- United Kingdom
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- A chaud Adressage Analyse thermique Assemblage brasage tendre Assemblage circuit intégré Aérospatiale Boîtier plat Brasage sans plomb Comportement thermique Composant électronique Durabilité Défaillance Endommagement Fiabilité Gradient température Industrie électronique Modèle thermique Modélisation Métal fondu brasage tendre Packaging électronique Procédé fabrication Revêtement Sécurité Trichite Vitesse refroidissement Connexion courte
- Keyword (en)
- Hot process Addressing Thermal analysis Soldered joint Integrated circuit bonding Aerospace Flat package Lead free soldering Thermal behavior Electronic component Durability Failures Damaging Reliability Temperature gradient Electronics industry Thermal model Modeling Solder metal Electronic packaging Manufacturing process Coatings Safety Whisker Cooling rate Small outline
- Keyword (es)
- En caliente Direccionamiento Análisis térmico Junta soldada Aeroespacial Estuche plano Soldeo sin plomo Comportamiento térmico Componente electrónico Durabilidad Fallo Deterioración Fiabilidad Gradiente temperatura Industria electrónica Modelo térmico Modelización Metal fundido soldeo blando Packaging electrónico Procedimiento fabricación Revestimiento Seguridad Triquito Velocidad enfriamiento Contorno pequeño
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03A General (including economical and industrial fields)
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F13 Thermoelectric, pyroelectric devices, etc
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 27595205
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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