Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS
- Author
- IWAMOTO, Nancy1
[1] Honeywell Specialty Materials, P.O. Box 547, Ramona, CA 92065, United States - Conference name
- EuroSimE 2012 International Conference (13 ; Cascais 2012-04-16)
- Source
Microelectronics and reliability. 2013, Vol 53, Num 8, pp 1101-1110, 10 p ; ref : 11 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Kidlington
- Publication country
- United Kingdom
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Adhérence Couche oxyde Encapsulation plastique Epoxyde résine Humidité Interface Modélisation Mésoéchelle Oxyde de cuivre Paramétrisation Polymère Rugosité Surface rugueuse Hétérostructure
- Keyword (en)
- Adhesion Oxide layer Plastic packaging Epoxy resin Humidity Interface Modeling Mesoscale Copper oxide Parameterization Polymer Roughness Rough surface Heterostructures
- Keyword (es)
- Adherencia Capa óxido Encapsulación plástica Epóxido resina Humedad Interfase Modelización Mesoescala Cobre óxido Parametrización Polímero Rugosidad Superficie rugosa Heteroestructura
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F01 Interfaces
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 27595210
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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