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Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Author
IWAMOTO, Nancy1
[1] Honeywell Specialty Materials, P.O. Box 547, Ramona, CA 92065, United States
Conference name
EuroSimE 2012 International Conference (13 ; Cascais 2012-04-16)
Source

Microelectronics and reliability. 2013, Vol 53, Num 8, pp 1101-1110, 10 p ; ref : 11 ref

CODEN
MCRLAS
ISSN
0026-2714
Scientific domain
Electronics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Conference Paper
Language
English
Keyword (fr)
Adhérence Couche oxyde Encapsulation plastique Epoxyde résine Humidité Interface Modélisation Mésoéchelle Oxyde de cuivre Paramétrisation Polymère Rugosité Surface rugueuse Hétérostructure
Keyword (en)
Adhesion Oxide layer Plastic packaging Epoxy resin Humidity Interface Modeling Mesoscale Copper oxide Parameterization Polymer Roughness Rough surface Heterostructures
Keyword (es)
Adherencia Capa óxido Encapsulación plástica Epóxido resina Humedad Interfase Modelización Mesoescala Cobre óxido Parametrización Polímero Rugosidad Superficie rugosa Heteroestructura
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F01 Interfaces

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
27595210

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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