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The influence of strain rate, deformation temperature and stacking fault energy on the mechanical properties of Cu alloys

Author
GONG, Y. L1 ; WEN, C. E3 ; WU, X. X2 ; REN, S. Y2 ; CHENG, L. P2 ; ZHU, X. K2
[1] Faculty of Science, Kunming University of Science and Technology, Kunming, Yunnan, China
[2] Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, Yunnan, China
[3] Faculty of Engineering and Industrial Sciences, Swinburne University of Technology, John Street, Hawthorn, Victoria 3122, Australia
Source

Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 583, pp 199-204, 6 p ; ref : 41 ref

ISSN
0921-5093
Scientific domain
Crystallography; Chemical industry parachemical industry; Metallurgy, welding; Condensed state physics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Author keyword
Copper alloys Mechanical properties Stacking fault energy (SFE) Strain rate Temperature
Keyword (fr)
Affinement grain Barre Hopkinson Cuivre alliage Densité dislocation Diffraction RX Diode électroluminescente Ductilité Défaut cristallin Défaut empilement Déformation plastique Dépendance température Effet température Essai traction Four induction Grande déformation Laminage Macle Optimisation Plasticité Propriété mécanique Propriété plastique Relation structure propriété Température cryogénique Traitement matériau Vitesse déformation 6172N 8140L 8560 8560J
Keyword (en)
Grain refinement Hopkinson bar Copper alloy Dislocation density X ray diffraction Light emitting diode Ductility Crystal defect Stacking fault Plastic deformation Temperature dependence Temperature effect Tension test Induction furnace High strain Rolling Crystal twin Optimization Plasticity Mechanical properties Plastic properties Property structure relationship Cryogenic temperature Material processing Strain rate
Keyword (es)
Afino grano Barra Hopkinson Cobre aleación Densidad dislocación Difracción RX Diodo electroluminescente Ductilidad Defecto cristalino Defecto apilado Deformación plástica Efecto temperatura Ensayo tracción Horno inducción Gran deformación Laminado Macla Optimización Plasticidad Propiedad mecánica Propiedad plástica Relación estructura propiedad Temperatura criogénica Tratamiento material Velocidad deformación
Keyword (de)
Kornfeinen Kupferlegierung Versetzungsdichte Roentgenbeugung Verformungsfaehigkeit Stapelfehler Plastische Verformung Temperatureinfluss Zugversuch Induktionsofen Walzen Zwilling Optimierung Plastizitaet Verformungsgeschwindigkeit
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60A Structure of solids and liquids; crystallography / 001B60A72 Defects and impurities in crystals; microstructure / 001B60A72N Stacking faults and other planar or extended defects

Pascal
001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A40 Treatment of materials and its effects on microstructure and properties / 001B80A40L Deformation, plasticity, and creep

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11C Production techniques / 001D11C04 Forming / 001D11C04B Rolling

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11G Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology / 001D11G01 Elasticity. Plasticity

Discipline
Metals. Metallurgy Physics and materials science Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
27658619

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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