Modeling the high-temperature creep behaviors of 7075 and 2124 aluminum alloys by continuum damage mechanics model
- Author
- LI, Lei-Ting1 2 ; LIN, Y. C1 2 ; ZHOU, Hua-Min3 ; JIANG, Yu-Qiang1 2
[1] School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
[2] State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China
[3] State Key Laboratory of Material Processing and Die & Mould Technology, Wuhan 430074, China - Source
Computational materials science. 2013, Vol 73, pp 72-78, 7 p ; ref : 45 ref
- ISSN
- 0927-0256
- Scientific domain
- Condensed state physics
- Publisher
- Elsevier, Amsterdam
- Publication country
- Netherlands
- Document type
- Article
- Language
- English
- Author keyword
- Aluminum alloy Constitutive model Creep
- Keyword (fr)
- Contrainte uniaxiale Endommagement Equation constitutive Essai traction Fluage Haute température Modélisation Mécanique milieu continu Rupture fluage
- Keyword (en)
- Uniaxial stress Damaging Constitutive equation Tension test Creep High temperature Modeling Continuum mechanics Creep fracture
- Keyword (es)
- Tensión uniaxial Deterioración Ecuación constitutiva Ensayo tracción Fluencia Alta temperatura Modelización Mecánica medio contínuo Ruptura fluencia
- Keyword (de)
- Einachsige Spannung Zugversuch Kriechen Hochtemperatur Kriechbruch
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11G Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology / 001D11G04 Creep
- Discipline
- Metals. Metallurgy
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 27674597
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.commatsci.2013.02.022 
https://dx.doi.org/10.1016/j.commatsci.2013.02.022
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