The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering
- Author
- JEONG HWAN LEE1 ; SUNG WOO MA1 ; YOUNG MIN KIM2 ; JIN SU LEE3 ; KI BUM KIM3 ; JAE MYUN KIM3 ; JAE SUNG OH3 ; NAMSEOG KIM3 ; KIM, Young-Ho2
[1] Division of Nano-scale Semiconductor Engineering, Hanyang University, Seoul 133-791, Korea, Republic of
[2] Division of Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea, Republic of
[3] SK Hynix Inc., San 136-1 Ami-ri, Bubal-eub, Icheon-si, Kyoungki-do 467-701, Korea, Republic of - Source
Journal of materials science. Materials in electronics. 2013, Vol 24, Num 9, pp 3255-3261, 7 p ; ref : 20 ref
- ISSN
- 0957-4522
- Scientific domain
- Electronics; Condensed state physics
- Publisher
- Springer, Norwell, MA
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Assemblage brasage tendre Assemblage circuit intégré Brasage avec refusion Brasage tendre Composé intermétallique Contact bosse Couche oxyde Cuivre Déformation Epaisseur Interface Microscopie optique Microscopie électronique balayage Microstructure Mouillabilité Mouillage Packaging électronique Réaction interface Spectrométrie dispersive Structure interface 0779 6808B 6865 Brasure
- Keyword (en)
- Soldered joint Integrated circuit bonding Reflow soldering Soldering Intermetallic compound Solder bump Oxide layer Copper Deformation Thickness Interface Optical microscopy Scanning electron microscopy Microstructure Wettability Wetting Electronic packaging Interface reaction Dispersive spectrometry Interface structure Solder
- Keyword (es)
- Junta soldada Soldeo con refusión Soldeo blando Compuesto intermetálico Contacto con bollos Capa óxido Cobre Deformación Espesor Interfase Microscopía óptica Microscopía electrónica barrido Microestructura Remojabilidad Remojo Packaging electrónico Reacción interfase Espectrometría dispersiva Estructura interfaz
- Keyword (de)
- Weichloetverbindung Aufschmelzloeten Weichloeten Intermetallische Verbindung Oxidschicht Kupfer Verformung Dicke Grenzflaeche Optische Mikroskopie Rasterelektronenmikroskopie Mikrogefuege Benetzbarkeit
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35F Diffusion; interface formation
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H45 Solid-fluid interfaces / 001B60H45G Wetting
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11D Joining, thermal cutting: metallurgical aspects / 001D11D02 Brazing. Soldering
- Discipline
- Electronics Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 27680824
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s10854-013-1238-7 
https://dx.doi.org/10.1007/s10854-013-1238-7
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