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Constant-Temperature Embossing of Supercooled Polymer Films

Author
RAMASUBRAMANI KUDUVA RAMAN THANUMOORTHY1 ; KIM, Byung H2 ; DONGGANG YAO1
[1] School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
[2] Department of Mechanical and Industrial Engineering, University of Massachusetts, Amherst, Massachusetts 01003, United States
Source

Polymer engineering and science. 2014, Vol 54, Num 5, pp 1100-1112, 13 p ; ref : 31 ref

CODEN
PYESAZ
ISSN
0032-3888
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley, Hoboken, NJ
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Condition isotherme Cristallisation Ester polymère Ethylène téréphtalate polymère Etude expérimentale Gaufrage Morphologie Optimisation Propriété thermique Relation mise en oeuvre propriété Relation mise en oeuvre structure Transition phase
Keyword (en)
Isothermal condition Crystallization Ester polymer Ethylene terephthalate polymer Experimental study Embossing Morphology Optimization Thermal properties Property processing relationship Structure processing relationship Phase transitions
Keyword (es)
Condición isoterma Cristalización Ester polímero Etileno tereftalato polímero Estudio experimental Gofrado Morfología Optimización Propiedad térmica Relación puesta en marcha propiedad Relación puesta en marcha estructura Transición fase
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A04 Machinery and processing / 001D10A04A Plastics / 001D10A04A8 Miscellaneous

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
28494930

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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