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Influences of in situ annealing on microstructure, residual stress and electrical resistivity for sputter-deposited Be coating

Autor
LUO, B. C1 2 ; LI, K1 ; TAN, X. L1 2 ; ZHANG, J. Q1 ; LUO, J. S1 ; JIANG, X. D1 ; WU, W. D1 ; TANG, Y. J1
[1] Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China
[2] Science and Technology on Plasma Physics Laboratory, Mianyang 621900, China
Fuente

Journal of alloys and compounds. 2014, Vol 607, pp 150-156, 7 p ; ref : 33 ref

ISSN
0925-8388
Campo Científico
Inorganic chemistry; Crystallography; Metallurgy, welding; Condensed state physics
Editor
Elsevier, Kidlington
País de la publicación
United Kingdom
Tipo de documento
Article
Idioma
English
Palabra clave de autor
Beryllium coating Electrical resistivity Grain boundary Residual stress Surface roughness
Palabra clave (fr)
Béryllium Conductivité électrique Contrainte résiduelle Diffraction RX Diffusion superficielle Grosseur grain Microstructure Pulvérisation cathodique Recristallisation Recuit Revêtement surface Réseau hexagonal compact
Palabra clave (in)
Beryllium Electrical conductivity Residual stresses XRD Surface diffusion Grain size Microstructure Cathode sputtering Recrystallization Annealing Surface coating HCP lattices
Clasificación
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H60 Physical properties of thin films, nonelectronic

Disciplina
Physics of condensed state : structure, mechanical and thermal properties
Procedencia
Inist-CNRS
Base de datos
PASCAL
Identificador INIST
28513277

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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