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Synthesis and Thermal Stability Properties of Boron-Doped Silicone Resin

Author
ZHIFENG HAO1 ; JIN ZHANG1 ; YAHONG WU1 ; JIAN YU1 ; LIN YU1
[1] School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China
Source

Journal of applied polymer science (Print). 2014, Vol 131, Num 20 ; 40934.1-40934.8 ; ref : 31 ref

CODEN
JAPNAB
ISSN
0021-8995
Scientific domain
Polymers, paint and wood industries
Publisher
Wiley, Hoboken, NJ
Publication country
United States
Document type
Article
Language
English
Author keyword
degradation polycondensation resins thermal properties thermogravimetric analysis (TGA)
Keyword (fr)
Acide borique Composition chimique Copolymère bore Copolymère réticulé Dégradation thermique Etude expérimentale Mécanisme réaction Polycondensation Propriété thermique Préparation Siloxane copolymère Stabilité thermique Structure moléculaire
Keyword (en)
Boric acid Chemical composition Boron copolymer Crosslinked copolymer Thermal degradation Experimental study Reaction mechanism Condensation polymerization Thermal properties Preparation Siloxane copolymer Thermal stability Molecular structure
Keyword (es)
Bórico ácido Composición química Copolímero boro Copolímero reticulado Degradación térmica Estudio experimental Mecanismo reacción Policondensación Propiedad térmica Preparación Siloxano copolímero Estabilidad térmica Estructura molecular
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D09 Physicochemistry of polymers / 001D09E Inorganic and organomineral polymers / 001D09E01 Preparation

Discipline
Physical chemistry of polymers
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
28691191

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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