Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry
- Author
- TING JIANG1 ; HONG LEI1
[1] Research Center of Nano-science and Nano-technology, Shanghai University, Shanghai 200444, China - Source
Journal of electronic materials. 2014, Vol 43, Num 11, pp 4186-4192, 7 p ; ref : 18 ref
- CODEN
- JECMA5
- ISSN
- 0361-5235
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Springer, Heidelberg
- Publication country
- Germany
- Document type
- Article
- Language
- English
- Author keyword
- Abrasive-free chemical polishing cumene hydroperoxide (CHP) initiator material removal rate mechanism
- Keyword (fr)
- Abrasif Boue liquide Disque dur Effet pression Planarisation Polissage chimique Polissage mécanochimique Radical libre Rugosité Résonance paramagnétique éléctronique Spectrométrie Auger Traitement surface Tête lecture Tête magnétique
- Keyword (en)
- Abrasives Slurries Hard discs Pressure effects Planarization Chemical polishing Chemical mechanical polishing Free radicals Roughness Electron paramagnetic resonance AES Surface treatments Read head Magnetic heads
- Keyword (es)
- Cabeza lectura
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B80 Cross-disciplinary physics: materials science; rheology / 001B80A Materials science / 001B80A65 Surface treatments
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03C Materials
- Discipline
- Electronics Physics and materials science
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 28883132
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1007/s11664-014-3303-2 
https://dx.doi.org/10.1007/s11664-014-3303-2
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