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A physical model and analysis for whisker growth caused by chemical intermetallic reaction

Author
LEI QIANG1 ; ZAIXING HUANG1
[1] State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, No. 29 Yudao Street, Nanjing 210016, China
Source

Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2494-2500, 7 p ; ref : 24 ref

CODEN
MCRLAS
ISSN
0026-2714
Scientific domain
Electronics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Composé intermétallique Contrainte interne Croissance cristalline Diffusion joint grain Etude expérimentale Fibre courte Modélisation Réaction chimique Trichite
Keyword (en)
Intermetallic compounds Internal stresses Crystal growth Grain boundary diffusion Experimental study Short fiber Modelling Chemical reactions Whiskers
Keyword (es)
Fibra corta
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35F Diffusion; interface formation

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
28945777

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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