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Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Author
LIM, Adeline B. Y1 2 ; CHANG, Andrew C. K1 ; YAUW, Oranna1 ; CHYLAK, Bob3 ; CHEE LIP GAN2 ; ZHONG CHEN2
[1] Kulicke & Soffa Pte. Ltd., 23A Serangoon North Avenue 5 #01-0 1, Singapore 554369, Singapore
[2] School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
[3] Kulicke & Soffa Industries Inc., 1005 Virginia Drive, Fort Washington, PA 19034, United States
Source

Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2555-2563, 9 p ; ref : 13 ref

CODEN
MCRLAS
ISSN
0026-2714
Scientific domain
Electronics
Publisher
Elsevier, Kidlington
Publication country
United Kingdom
Document type
Article
Language
English
Keyword (fr)
Circuit intégré Cuivre Essai dureté Essai haute température Fiabilité Interconnexion Matériau revêtu Microcâblage Or Packaging électronique Palladium Revêtement
Keyword (en)
Integrated circuit Copper Hardness test High temperature test Reliability Interconnection Coated material Wire bonding Gold Electronic packaging Palladium Coatings
Keyword (es)
Circuito integrado Cobre Ensayo dureza Prueba alta temperatura Fiabilidad Interconexión Material revestido Unión por hilo Oro Packaging electrónico Paladio Revestimiento
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
28945784

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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