Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters
- Author
- LIM, Adeline B. Y1 2 ; CHANG, Andrew C. K1 ; YAUW, Oranna1 ; CHYLAK, Bob3 ; CHEE LIP GAN2 ; ZHONG CHEN2
[1] Kulicke & Soffa Pte. Ltd., 23A Serangoon North Avenue 5 #01-0 1, Singapore 554369, Singapore
[2] School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
[3] Kulicke & Soffa Industries Inc., 1005 Virginia Drive, Fort Washington, PA 19034, United States - Source
Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2555-2563, 9 p ; ref : 13 ref
- CODEN
- MCRLAS
- ISSN
- 0026-2714
- Scientific domain
- Electronics
- Publisher
- Elsevier, Kidlington
- Publication country
- United Kingdom
- Document type
- Article
- Language
- English
- Keyword (fr)
- Circuit intégré Cuivre Essai dureté Essai haute température Fiabilité Interconnexion Matériau revêtu Microcâblage Or Packaging électronique Palladium Revêtement
- Keyword (en)
- Integrated circuit Copper Hardness test High temperature test Reliability Interconnection Coated material Wire bonding Gold Electronic packaging Palladium Coatings
- Keyword (es)
- Circuito integrado Cobre Ensayo dureza Prueba alta temperatura Fiabilidad Interconexión Material revestido Unión por hilo Oro Packaging electrónico Paladio Revestimiento
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F06 Integrated circuits / 001D03F06A Design. Technologies. Operation analysis. Testing
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 28945784
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.microrel.2014.05.005 
https://dx.doi.org/10.1016/j.microrel.2014.05.005
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