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Preparation of low density free-standing shape of SiC by pressure-pulsed chemical vapour infiltration

Author
SUGIYAMA, K; NORIZUKI, K
Aichi inst. technology, dep. applied chemistry, Yakusacho, Toyoda 470-03, Japan
Source

Journal of materials science letters. 1995, Vol 14, Num 23, pp 1720-1722 ; ref : 7 ref

CODEN
JMSLD5
ISSN
0261-8028
Scientific domain
Chemical industry parachemical industry; Metallurgy, welding; Condensed state physics; Polymers, paint and wood industries
Publisher
Kluwer Academic Publishers, Dordrecht
Publication country
Netherlands
Document type
Article
Language
English
Keyword (fr)
Céramique sans oxyde Dépôt chimique phase vapeur Etude expérimentale Fabrication Infiltration Matériau poreux Propriété mécanique Propriété physique Pulsation Résistance flexion Silicium Carbure Sous pression Infiltration chimique phase vapeur SiC
Keyword (en)
Non oxide ceramics Chemical vapor deposition Experimental study Manufacturing Infiltration Porous material Mechanical properties Physical properties Pulse Bending strength Silicon Carbides Under pressure Chemical vapor infiltration
Keyword (es)
Cerámica sin óxido Depósito químico fase vapor Estudio experimental Fabricación Infiltración Material poroso Propiedad mecánica Propiedad física Pulsación Resistencia flexión Silicio Carburo Bajo presión
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D08 Chemical industry and chemicals / 001D08B Building materials. Ceramics. Glasses / 001D08B04 Ceramic industries / 001D08B04C Technical ceramics / 001D08B04C6 Miscellaneous

Discipline
Chemical and parachemical industries
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
2953098

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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