Low temperature sinterable multilayer glass-ceramic substrates
- Author
- FU, S. L; CHEN, L. S; LU, J. N
Kaohsiung polytech. inst., Kaohsiung, Taiwan, Province of China - Conference name
- European Microelectronics Conference (10 ; Copenhagen 1995-05)
- Source
Microelectronics international. 1996, Vol 39, Num JAN, pp 20-21 ; 25 [3 p.] ; ref : 10 ref
- ISSN
- 1356-5362
- Scientific domain
- Electronics
- Publisher
- MCB University Press, Bradford
- Publication country
- United Kingdom
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Borosilicate Cordiérite Etude expérimentale Fabrication microélectronique Substrat Verre Vitrocéramique
- Keyword (en)
- Borosilicates Cordierite Experimental study Microelectronic fabrication Substrate Glass Glass ceramics
- Keyword (es)
- Borosilicato Cordierita Estudio experimental Fabricación microeléctrica Substrato Vidrio Vidriocerámica
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 2992155
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Access to the document
Install on your browser
DOI
10.1108/13565369610800133 
https://dx.doi.org/10.1108/13565369610800133
"O:13:\"PanistOpenUrl\":36:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000idc\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1108\/13565369610800133\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:9:\"\u0000*\u0000jtitle\";s:30:\"Microelectronics international\";s:9:\"\u0000*\u0000stitle\";s:17:\"Microelectro. int\";s:7:\"\u0000*\u0000date\";s:4:\"1996\";s:9:\"\u0000*\u0000volume\";s:2:\"39\";s:8:\"\u0000*\u0000issue\";s:3:\"JAN\";s:8:\"\u0000*\u0000spage\";s:2:\"20\";s:8:\"\u0000*\u0000epage\";s:2:\"21\";s:8:\"\u0000*\u0000pages\";s:9:\"25 [3 p.]\";s:7:\"\u0000*\u0000issn\";s:9:\"1356-5362\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:2:\"FU\";s:10:\"\u0000*\u0000aufirst\";s:4:\"S. L\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:2:{i:0;s:10:\"CHEN, L. S\";i:1;s:8:\"LU, J. N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:8:\"\u0000*\u0000place\";s:8:\"Bradford\";s:6:\"\u0000*\u0000pub\";s:20:\"MCB University Press\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Panist access
"O:12:\"IstexOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1108\/13565369610800133\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:9:\"\u0000*\u0000jtitle\";s:30:\"Microelectronics international\";s:9:\"\u0000*\u0000stitle\";s:17:\"Microelectro. int\";s:7:\"\u0000*\u0000date\";s:4:\"1996\";s:9:\"\u0000*\u0000volume\";s:2:\"39\";s:8:\"\u0000*\u0000issue\";s:3:\"JAN\";s:8:\"\u0000*\u0000spage\";s:2:\"20\";s:8:\"\u0000*\u0000epage\";s:2:\"21\";s:8:\"\u0000*\u0000pages\";s:9:\"25 [3 p.]\";s:7:\"\u0000*\u0000issn\";s:9:\"1356-5362\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:2:\"FU\";s:10:\"\u0000*\u0000aufirst\";s:4:\"S. L\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:2:{i:0;s:10:\"CHEN, L. S\";i:1;s:8:\"LU, J. N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:8:\"\u0000*\u0000place\";s:8:\"Bradford\";s:6:\"\u0000*\u0000pub\";s:20:\"MCB University Press\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Istex access
"O:16:\"UnpaywallOpenUrl\":35:{s:8:\"\u0000*\u0000email\";s:27:\"assistance-portail@inist.fr\";s:6:\"\u0000*\u0000fmt\";N;s:6:\"\u0000*\u0000doi\";s:25:\"10.1108\/13565369610800133\";s:6:\"\u0000*\u0000pii\";N;s:7:\"\u0000*\u0000pmid\";N;s:9:\"\u0000*\u0000atitle\";N;s:9:\"\u0000*\u0000jtitle\";N;s:9:\"\u0000*\u0000stitle\";N;s:7:\"\u0000*\u0000date\";N;s:9:\"\u0000*\u0000volume\";N;s:8:\"\u0000*\u0000issue\";N;s:8:\"\u0000*\u0000spage\";N;s:8:\"\u0000*\u0000epage\";N;s:8:\"\u0000*\u0000pages\";N;s:7:\"\u0000*\u0000issn\";N;s:8:\"\u0000*\u0000eissn\";N;s:9:\"\u0000*\u0000aulast\";N;s:10:\"\u0000*\u0000aufirst\";N;s:9:\"\u0000*\u0000auinit\";N;s:10:\"\u0000*\u0000auinitm\";N;s:5:\"\u0000*\u0000au\";N;s:9:\"\u0000*\u0000aucorp\";N;s:7:\"\u0000*\u0000isbn\";N;s:8:\"\u0000*\u0000coden\";N;s:8:\"\u0000*\u0000genre\";N;s:7:\"\u0000*\u0000part\";N;s:9:\"\u0000*\u0000btitle\";N;s:8:\"\u0000*\u0000title\";N;s:8:\"\u0000*\u0000place\";N;s:6:\"\u0000*\u0000pub\";N;s:10:\"\u0000*\u0000edition\";N;s:9:\"\u0000*\u0000tpages\";N;s:9:\"\u0000*\u0000series\";N;s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";N;}"
Unpaywall access
"O:16:\"EuropePMCOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1108\/13565369610800133\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:9:\"\u0000*\u0000jtitle\";s:30:\"Microelectronics international\";s:9:\"\u0000*\u0000stitle\";s:17:\"Microelectro. int\";s:7:\"\u0000*\u0000date\";s:4:\"1996\";s:9:\"\u0000*\u0000volume\";s:2:\"39\";s:8:\"\u0000*\u0000issue\";s:3:\"JAN\";s:8:\"\u0000*\u0000spage\";s:2:\"20\";s:8:\"\u0000*\u0000epage\";s:2:\"21\";s:8:\"\u0000*\u0000pages\";s:9:\"25 [3 p.]\";s:7:\"\u0000*\u0000issn\";s:9:\"1356-5362\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:2:\"FU\";s:10:\"\u0000*\u0000aufirst\";s:4:\"S. L\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:2:{i:0;s:10:\"CHEN, L. S\";i:1;s:8:\"LU, J. N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:8:\"\u0000*\u0000place\";s:8:\"Bradford\";s:6:\"\u0000*\u0000pub\";s:20:\"MCB University Press\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Europe PubMed Central access
"O:11:\"BaseOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1108\/13565369610800133\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:9:\"\u0000*\u0000jtitle\";s:30:\"Microelectronics international\";s:9:\"\u0000*\u0000stitle\";s:17:\"Microelectro. int\";s:7:\"\u0000*\u0000date\";s:4:\"1996\";s:9:\"\u0000*\u0000volume\";s:2:\"39\";s:8:\"\u0000*\u0000issue\";s:3:\"JAN\";s:8:\"\u0000*\u0000spage\";s:2:\"20\";s:8:\"\u0000*\u0000epage\";s:2:\"21\";s:8:\"\u0000*\u0000pages\";s:9:\"25 [3 p.]\";s:7:\"\u0000*\u0000issn\";s:9:\"1356-5362\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:2:\"FU\";s:10:\"\u0000*\u0000aufirst\";s:4:\"S. L\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:2:{i:0;s:10:\"CHEN, L. S\";i:1;s:8:\"LU, J. N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:8:\"\u0000*\u0000place\";s:8:\"Bradford\";s:6:\"\u0000*\u0000pub\";s:20:\"MCB University Press\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
Base Search access
"O:12:\"ArXivOpenUrl\":35:{s:10:\"\u0000*\u0000openUrl\";N;s:6:\"\u0000*\u0000fmt\";s:10:\"proceeding\";s:6:\"\u0000*\u0000doi\";s:25:\"10.1108\/13565369610800133\";s:6:\"\u0000*\u0000pii\";s:0:\"\";s:7:\"\u0000*\u0000pmid\";s:0:\"\";s:9:\"\u0000*\u0000atitle\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:9:\"\u0000*\u0000jtitle\";s:30:\"Microelectronics international\";s:9:\"\u0000*\u0000stitle\";s:17:\"Microelectro. int\";s:7:\"\u0000*\u0000date\";s:4:\"1996\";s:9:\"\u0000*\u0000volume\";s:2:\"39\";s:8:\"\u0000*\u0000issue\";s:3:\"JAN\";s:8:\"\u0000*\u0000spage\";s:2:\"20\";s:8:\"\u0000*\u0000epage\";s:2:\"21\";s:8:\"\u0000*\u0000pages\";s:9:\"25 [3 p.]\";s:7:\"\u0000*\u0000issn\";s:9:\"1356-5362\";s:8:\"\u0000*\u0000eissn\";s:0:\"\";s:9:\"\u0000*\u0000aulast\";s:2:\"FU\";s:10:\"\u0000*\u0000aufirst\";s:4:\"S. L\";s:9:\"\u0000*\u0000auinit\";s:0:\"\";s:10:\"\u0000*\u0000auinitm\";s:0:\"\";s:5:\"\u0000*\u0000au\";a:2:{i:0;s:10:\"CHEN, L. S\";i:1;s:8:\"LU, J. N\";}s:9:\"\u0000*\u0000aucorp\";s:0:\"\";s:7:\"\u0000*\u0000isbn\";s:0:\"\";s:8:\"\u0000*\u0000coden\";s:0:\"\";s:8:\"\u0000*\u0000genre\";s:10:\"proceeding\";s:7:\"\u0000*\u0000part\";s:0:\"\";s:9:\"\u0000*\u0000btitle\";s:0:\"\";s:8:\"\u0000*\u0000title\";s:62:\"Low temperature sinterable multilayer glass-ceramic substrates\";s:8:\"\u0000*\u0000place\";s:8:\"Bradford\";s:6:\"\u0000*\u0000pub\";s:20:\"MCB University Press\";s:10:\"\u0000*\u0000edition\";s:0:\"\";s:9:\"\u0000*\u0000tpages\";s:0:\"\";s:9:\"\u0000*\u0000series\";s:0:\"\";s:8:\"\u0000*\u0000proxy\";s:30:\"http:\/\/proxyout.inist.fr:8080\/\";s:12:\"\u0000*\u0000integrite\";b:1;}"
arXiv access
