Microstructural evolution of copper thick films observed by environmental scanning electron microscopy
- Author
- SAMPLE, D. R1 ; BROWN, P. W1 ; DOUGHERTY, J. P1
[1] The Center for Dielectric Studies, The Materials Research Laboratory, The Pennsylvania State University, University Park, Pennsylvania 16802, United States - Source
Journal of the American Ceramic Society. 1996, Vol 79, Num 5, pp 1303-1306 ; ref : 18 ref
- CODEN
- JACTAW
- ISSN
- 0002-7820
- Scientific domain
- Chemical industry parachemical industry
- Publisher
- Blackwell, Malden,MA
- Publication country
- United States
- Document type
- Article
- Language
- English
- Keyword (fr)
- Additif Couche épaisse Dépendance température Encre Etude expérimentale Fer Film Microstructure SEM Fe Métal transition
- Keyword (en)
- Additives Thick film Temperature dependence Inks Experimental study Iron Films Microstructure SEM Transition elements
- Keyword (es)
- Capa espesa
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H55 Thin film structure and morphology / 001B60H55J Structure and morphology; thickness
- Discipline
- Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 3101150
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1111/j.1151-2916.1996.tb08588.x 
https://dx.doi.org/10.1111/j.1151-2916.1996.tb08588.x
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