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Modelling of interafacial fracture

Author
RABINOVICH, V. L1 ; SARIN, V. K1
[1] Manufacturing Engineering, Boston University, Boston, MA 02215, United States
Conference title
ICSHM 5: International Conference on the Science of Hard Materials
Conference name
ICSHM 5: International Conference on the Science of Hard Materials (5 ; Maui, Hawaii 1995-02-20)
Author (monograph)
SARIN, Vinot K (Editor)1
[1] Manufacturing Engineering, Boston University, Boston, MA 02215, United States
Source

Materials science & engineering. A, Structural materials : properties, microstructure and processing. 1996, Vol 209, Num 1-2, pp 82-90 ; ref : 17 ref

ISSN
0921-5093
Scientific domain
Crystallography; Chemical industry parachemical industry; Metallurgy, welding; Condensed state physics
Publisher
Elsevier, Amsterdam
Publication country
Netherlands
Document type
Conference Paper
Language
English
Keyword (fr)
Adhérence Indentation Interface Matériau fragile Modélisation Propriété mécanique Revêtement Rupture
Keyword (en)
Adhesion Indentation Interfaces Brittle material Modeling Mechanical properties Coatings Ruptures
Keyword (es)
Material frágil Modelización
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces / 001B60H35J Surface and interface dynamics and vibrations

Pacs
6835J Surface and interface dynamics and vibrations

Discipline
Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3141438

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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