Preparation of Ta2Al intermetallic compound films and their application as diffusion barriers to Cu penetration
- Author
- OHTA, A1 ; NOYA, A1 ; TAKEYAMA, M1 ; TAGUCHI, M1 ; SASE, T1 ; SASAKI, K
[1] Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology, Kitami 090, Japan - Source
Thin solid films. 1996, Vol 278, Num 1-2, pp 6-11 ; ref : 20 ref
- CODEN
- THSFAP
- ISSN
- 0040-6090
- Scientific domain
- Crystallography; Electronics; Metallurgy, welding; Condensed state physics
- Publisher
- Elsevier Science, Lausanne
- Publication country
- Switzerland
- Document type
- Article
- Language
- English
- Keyword (fr)
- Alliage base tantale Alliage binaire Aluminium alliage Composé intermétallique Contact Couche mince Cuivre Diffusion(transport) Etude expérimentale Métallisation Profil diffusion Siliciure Spectrométrie Auger XRD Al Ta Alliage Ta93Al7
- Keyword (en)
- Tantalum base alloys Binary alloys Aluminium alloys Intermetallic compounds Contact Thin films Copper Diffusion Experimental study Metallization Diffusion profile Silicides AES XRD
- Keyword (es)
- Contacto Perfil difusión
- Classification
- Pascal
- 001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H55 Thin film structure and morphology / 001B60H55J Structure and morphology; thickness
- Discipline
- Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 3142106
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/0040-6090(95)08119-4 
https://dx.doi.org/10.1016/0040-6090(95)08119-4
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