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An investigation of the friction and wear properties of nanometer Si3N4 filled PEEK

Author
WANG, Q1 ; XU, J1 ; SHEN, W1 ; LIU, W1
[1] Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China
Source

Wear. 1996, Vol 196, Num 1-2, pp 82-86 ; ref : 13 ref

CODEN
WEARAH
ISSN
0043-1648
Scientific domain
Chemical engineering; Mechanical engineering; Mechanics acoustics; Metallurgy, welding
Publisher
Elsevier Science, Amsterdam / Elsevier Science, Lausanne / Elsevier Science, New York, NY
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
Analyse surface Etherethercétone polymère Etude expérimentale Frottement Matériau composite Matériau renforcé dispersion Morphologie Nanostructure Relation composition propriété Résistance usure Silicium Nitrure Propriété mécanique
Keyword (en)
Surface analysis Polyetheretherketone Experimental study Friction Composite material Dispersion reinforced material Morphology Nanostructure Property composition relationship Wear resistance Silicon Nitrides Mechanical properties
Keyword (es)
Análisis superficie Eter éter cetona polímero Estudio experimental Frotamiento Material compuesto Material renforzado dispersión Morfología Nanoestructura Relación composición propiedad Resistencia al desgaste Silicio Nitruro Propiedad mecánica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D10 Polymer industry, paints, wood / 001D10A Technology of polymers / 001D10A06 Forms of application and semi-finished materials / 001D10A06H Composites

Discipline
Polymer industry, paints, wood
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3183120

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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