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FASTHENRY : a multipole-accelerated 3-D inductance extraction program

Author
KAMON, M1 ; TSUK, M. J; WHITE, J. K1
[1] MIT, dep. electrical eng. computer sci., res. lab. electronics, Cambridge MA 02139, United States
Issue title
Interconnects and packaging
Source

IEEE transactions on microwave theory and techniques. 1994, Vol 42, Num 9, pp 1750-1758 ; 2 ; ref : 14 ref

CODEN
IETMAB
ISSN
0018-9480
Scientific domain
Electronics; Optics; Telecommunications
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Boîtier Caractéristique électrique Circuit hyperfréquence Circuit intégré Conception assistée Etude théorique Modèle 3 dimensions Méthode maille Simulation numérique Extraction paramètre
Keyword (en)
Package Electrical characteristic Microwave circuit Integrated circuit Computer aided design Theoretical study Three dimensional model Mesh method Numerical simulation Parameter extraction
Keyword (es)
Estuche Característica eléctrica Circuito hiperfrecuencia Circuito integrado Concepción asistida Estudio teórico Modelo 3 dimensiones Método malla Simulación numérica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03G Electric, optical and optoelectronic circuits / 001D03G02 Circuit properties / 001D03G02B Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3296549

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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