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Molecular dynamics simulations of friction in self-assembled monolayers

Author
TUPPER, K. J; BRENNER, D. W
Naval res. lab., surface chemistry branch, Washington DC 20375-5342, United States
Conference title
International conference on metallurgical coatings and thin films
Conference name
International conference on metallurgical coatings and thin films (21 ; San Diego CA 1994-04-25)
Author (monograph)
SARTWELL, B. D (Editor); MCGUIRE, G. E (Editor)1 ; JEHN, Hermann A (Editor)
[1] Cent. microelectronics, MCNC, Research Triangle Park NC 27709, United States
Source

Thin solid films. 1994, Vol 253, Num 1-2, pp 185-189 ; ref : 16 ref

CODEN
THSFAP
ISSN
0040-6090
Scientific domain
Crystallography; Electronics; Metallurgy, welding; Condensed state physics
Publisher
Elsevier Science, Lausanne
Publication country
Switzerland
Document type
Conference Paper
Language
English
Keyword (fr)
Calcul dynamique moléculaire Compression Couche monomoléculaire Frottement Or Simulation Surface
Keyword (en)
Molecular dynamics calculations Compression Monolayers Friction Gold Simulation Surfaces
Classification
Pascal
001 Exact sciences and technology / 001B Physics / 001B60 Condensed matter: structure, mechanical and thermal properties / 001B60H Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) / 001B60H35 Solid surfaces and solid-solid interfaces

Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy

Pacs
6835 Solid surfaces and solid-solid interfaces

Discipline
Metals. Metallurgy Physics of condensed state : structure, mechanical and thermal properties
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3338873

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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