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Longevity of high power resistive magnets cooled by oxygen-free water

Author
MIURA, S; HOSHI, A; NAKAGAWA, Y
Tohoku univ., inst. materials res., Sendai 980, Japan
Conference title
MT-13 : international conference on magnet technology
Conference name
MT-13 : international conference on magnet technology (13 ; Victoria BC 1993-09-20)
Author (monograph)
University of Victoria, Victoria BC, Canada (Funder/Sponsor)
TRIUMF, Canada (Funder/Sponsor)
Source

IEEE transactions on magnetics. 1994, Vol 30, Num 4, pp 2479-2482 ; 2 ; ref : 6 ref

CODEN
IEMGAQ
ISSN
0018-9464
Scientific domain
Electronics; Metallurgy, welding; Condensed state physics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Aimant Cuivre oxyde Dispositif expérimental Durée vie Electroaimant Electrotechnique Enroulement Etude expérimentale Fluide refroidissement Oxydation Refroidissement eau Résistivité électrique
Keyword (en)
Magnet Copper oxide Experimental device Lifetime Electromagnet Electrical engineering Winding Experimental study Coolant Oxidation Water cooling Electric resistivity
Keyword (es)
Imán Cobre óxido Dispositivo experimental Tiempo vida Electroimán Electrotecnia Arrollamiento Estudio experimental Fluido refrigeración Oxidación Enfriamiento agua Resistividad eléctrica
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D05 Electrical engineering. Electrical power engineering / 001D05G Various equipment and components / 001D05G01 Electromagnets

Discipline
Electrical engineering. Electroenergetics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3353216

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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