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Low cycle fatigue behavior of a SiCp reinforced aluminum matrix composite at ambient and elevated temperature

Author
HAN, N. L; WANG, Z. G; SUN, L. Z
Acad. sinica, inst. metal res., state key lab. fatigue fracture materials, Shenyang 110015, China
Source

Scripta metallurgica et materialia. 1995, Vol 32, Num 11, pp 1739-1745 ; ref : 12 ref

ISSN
0956-716X
Scientific domain
Crystallography; Metallurgy, welding; Condensed state physics
Publisher
Pergamon Press, New York, NY / Pergamon Press, Oxford / Pergamon Press, Seoul
Publication country
United States
Document type
Article
Language
English
Keyword (fr)
Aluminium Durée vie fatigue Etude expérimentale Fatigue oligocyclique Matériau composite Métal renforcé dispersion Propriété mécanique Propriété traction Rupture SEM Silicium carbure Composite particule Al SiC
Keyword (en)
Aluminium Fatigue life Experimental study Low cycle fatigue Composite material Dispersion strengthened metal Mechanical properties Tensile property Rupture SEM Silicon carbide
Keyword (es)
Aluminio Longevidad fatiga Estudio experimental Fatiga oligocíclica Material compuesto Metal reforzado dispersión Propiedad mecánica Propiedad tracción Ruptura Silicio carburo
Keyword (de)
Aluminium Ermuedungslebensdauer Experimentelle Untersuchung Ermuedung bei niedrigen Lastspielzahlen Verbundwerkstoff Dispersionsgehaertetes Metall Zugeigenschaft Bruch Siliciumcarbid
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D11 Metals. Metallurgy / 001D11G Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology / 001D11G03 Fatigue

Discipline
Metals. Metallurgy
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3562621

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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