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Moisture sensitivity and reliability of plastic thermally enhanced QFP packages

Author
YIP, L
VLSI Technology Inc., San Jose CA 95131, United States
Conference name
Electronic components and technology conference (44 ; Washington DC 1994-05-01)
Source

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1995, Vol 18, Num 3, pp 485-490 ; ref : 7 ref

ISSN
1070-9894
Scientific domain
Electronics
Publisher
Institute of Electrical and Electronics Engineers, New York, NY
Publication country
United States
Document type
Conference Paper
Language
English
Keyword (fr)
Boîtier plat Dissipateur thermique Encapsulation plastique Essai fissuration Essai hygrométrique Etude expérimentale Fiabilité Forme carrée
Keyword (en)
Flat package Heat sinks Plastic packaging Cracking test Moisture test Experimental study Reliability Square shape
Keyword (es)
Estuche plano Encapsulación plástica Prueba fisuración Prueba humedad Estudio experimental Forma cuadrada
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03B Testing, measurement, noise and reliability

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3635864

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

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