Moisture sensitivity and reliability of plastic thermally enhanced QFP packages
- Author
- YIP, L
VLSI Technology Inc., San Jose CA 95131, United States - Conference name
- Electronic components and technology conference (44 ; Washington DC 1994-05-01)
- Source
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1995, Vol 18, Num 3, pp 485-490 ; ref : 7 ref
- ISSN
- 1070-9894
- Scientific domain
- Electronics
- Publisher
- Institute of Electrical and Electronics Engineers, New York, NY
- Publication country
- United States
- Document type
- Conference Paper
- Language
- English
- Keyword (fr)
- Boîtier plat Dissipateur thermique Encapsulation plastique Essai fissuration Essai hygrométrique Etude expérimentale Fiabilité Forme carrée
- Keyword (en)
- Flat package Heat sinks Plastic packaging Cracking test Moisture test Experimental study Reliability Square shape
- Keyword (es)
- Estuche plano Encapsulación plástica Prueba fisuración Prueba humedad Estudio experimental Forma cuadrada
- Classification
- Pascal
- 001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03B Testing, measurement, noise and reliability
- Discipline
- Electronics
- Origin
- Inist-CNRS
- Database
- PASCAL
- INIST identifier
- 3635864
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/96.404106 
https://dx.doi.org/10.1109/96.404106
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