Pascal and Francis Bibliographic Databases

Help

Export

Selection :

Permanent link
http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=3671894

Chemical processes in the chemical mechanical polishing of copper

Author
STEIGERWALD, J. M; MURARKA, S. P; GUTMANN, R. J; DUQUETTE, D. J
Rensselaer polytech. inst., cent. integrated electronics, Troy NY 12180, United States
Issue title
Copper metallization for future VLSI
Author (monograph)
MURARKA, Shyam P (Editor)1 ; GUTMANN, Ronald J (Editor)1
[1] Rensselaer polytech. inst. ; cent. integrated electronics, Troy NY 12180, United States
Source

Materials chemistry and physics. 1995, Vol 41, Num 3, pp 217-228 ; ref : 27 ref

CODEN
MCHPDR
ISSN
0254-0584
Scientific domain
Chemistry; Metallurgy, welding; Physics
Publisher
Elsevier, Lausanne
Publication country
Switzerland
Document type
Article
Language
English
Keyword (fr)
Abrasion Cuivre Etude expérimentale Fabrication microélectronique Métallisation Polissage chimique Polissage mécanique Polissage Traitement surface
Keyword (en)
Abrasion Copper Experimental study Microelectronic fabrication Metallizing Chemical polishing Mechanical polishing Polishing Surface treatment
Keyword (es)
Abrasión Cobre Estudio experimental Fabricación microeléctrica Metalización Pulido químico Pulido mecánico Pulimiento Tratamiento superficie
Classification
Pascal
001 Exact sciences and technology / 001D Applied sciences / 001D03 Electronics / 001D03F Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices / 001D03F17 Microelectronic fabrication (materials and surfaces technology)

Discipline
Electronics
Origin
Inist-CNRS
Database
PASCAL
INIST identifier
3671894

Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS

Access to the document

Searching the Web